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MSI X99A Xpower Gaming Titanium (LGA 2011-v3, Intel X99, E-ATX)

Art-Nr 5890394
 only 3 piece(s) in our warehouse

Availability

Mail delivery

  • only 3 piece(s)
    in our warehouse

PickMup

Collection

  • Basel: tomorrow at 13:10
  • Bern: tomorrow at 12:45
  • Dietikon: tomorrow at 14:30
  • Geneva: tomorrow at 13:30
  • Kriens: tomorrow at 11:20
  • Lausanne: tomorrow at 15:40
  • St Gallen: tomorrow at 15:30
  • Winterthur: tomorrow at 13:30
  • Wohlen: only 3 piece(s)
  • Zurich: today at 17:30

If ordered immediately.
Information subject to change.

View details

Specifications

Key specifications

PCI express version (max.)3
Multi-GPU technologyNVIDIA Quad-SLI, AMD Quad-GPU CrossFireX

General information

Manufacturer MSI
Product type Motherboards
i

Motherboards

In personal computers, a motherboard is the central printed circuit board (PCB) in many modern computers and holds many of the crucial components of the system, providing connectors for other peripherals. The motherboard is sometimes alternatively known as the mainboard, system board, or, on Apple computers, the logic board. It is also sometimes casually shortened to mobo.

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Item number5890394
Manufacturer no.7A21-002R
Release date13.07.2016
Sales rank in Product type Motherboards109 of 348

Motherboard properties

Form factor
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Form factor

In der Computertechnik ist der Formfaktor eine Angabe über Größe und Befestigungsmöglichkeiten eines Bauteils, das in einem Computer Verwendung findet. Durch diese Standardisierung können verschiedene Komponenten einfach zusammengefügt und ausgetauscht werden.

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E-ATX
CPU socket
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CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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LGA 2011-v3
Chipset
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Chipset

Der Chipsatz unterstützt den Prozessor bei seiner Aufgabe.

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Intel X99
UEFI BIOS
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UEFI BIOS

The Unified Extensible Firmware Interface (UEFI) is a specification that defines a software interface between an operating system and platform firmware. UEFI is meant as a replacement for the Basic Input/Output System (BIOS) firmware interface, present in all IBM PC-compatible personal computers. In practice, most UEFI images have legacy support for BIOS services. UEFI can be used to allow remote diagnostics and repair of computers, even without another operating system.

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Yes

Processor compatibility

Processor family
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Processor family

The family the processor belongs to.

Core i7 6th Gen

Memory

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Memory

Computer data storage, often called storage or memory, is a technology consisting of computer components and recording media used to retain digital data. It is a core function and fundamental component of computers.

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Number of memory modules
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Number of memory modules

Ein Speichermodul oder Speicherriegel ist eine kleine Leiterplatte, auf der mehrere Speicherbausteine (Dynamisches RAM in Form von integrierten Schaltkreisen) aufgelötet sind. Speichermodule bilden oder erweitern den Arbeitsspeicher elektronischer Geräte wie Computer oder Drucker und werden dort in speziell dafür vorgesehene Steckplätze gesteckt.

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8 x
Max. memory
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Max. memory

Ein Datenspeicher oder Speichermedium dient zur Speicherung von Daten beziehungsweise Informationen. Der Begriff Speichermedium wird auch als Synonym für einen konkreten Datenträger verwendet.

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128 GB
Memory chip
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Memory chip

Random-access memory is a form of computer data storage. A random-access device allows stored data to be accessed directly in any random order. In contrast, other data storage media such as hard disks, CDs, DVDs and magnetic tape, as well as early primary memory types such as drum memory, read and write data only in a predetermined order, consecutively, because of mechanical design limitations. Therefore the time to access a given data location varies significantly depending on its physical location.

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DDR4-2400
Max. RAM OC
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Max. RAM OC

Describes how much memory can be overclocked (maxium RAM overclocking).

3466 MHz
Memory type
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Memory type

DDR-SDRAM („Double Data Rate Synchronous Dynamic Random Access Memory“) ist ein Typ von Random Access Memory (RAM), den es aktuell in drei Kategorien gibt. DDR-SDRAM mit 184 Kontakten, DDR2-SDRAM mit 240 Kontakten und DDR3-SDRAM ebenfalls mit 240 Kontakten. Verwendet werden sie hauptsächlich für Speichermodule des DIMM- bzw. SO-DIMM-Standards als Arbeitsspeicher in PCs und Laptops.

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DDR4-RAM
Channel Architektur
RAM buffer
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RAM buffer

In addition to bandwidth and capacity variants, modules can
1. Optionally implement ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC in their designation.
2. Be "registered", which improves signal integrity (and hence potentially clock speed and physical slot capacity) by electrically buffering the signals at a cost of an extra clock of increased latency. Those modules are identified by an additional R in their designation, whereas non-registered (a.k.a. "unbuffered") RAM may be identified by an additional U in the designation.
3. Be Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion.

unbuffered
Memory form factor
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Memory form factor

A DIMM or dual in-line memory module, comprises a series of dynamic random access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.

The main difference between SIMMs and DIMMs is that DIMMs have separate electrical contacts on each side of the module, while the contacts on SIMMs on both sides are redundant. Another difference is that standard SIMMs have a 32-bit data path, while standard DIMMs have a 64-bit data path.

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DIMM 288

Mass storage controller 1

Data storage controller
Intel X99
S-ATA III
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S-ATA III

Serial ATA (SATA) is a computer bus interface for connecting host bus adapters to mass storage devices such as hard disk drives and optical drives. Serial ATA 3 can transfer up to 6 Gbit/s.

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10 x
eSATA
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eSATA

Standardized in 2004, eSATA (e standing for external) provides a variant of SATA meant for external connectivity.

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1 x
M.2
1 x
RAID configuration
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RAID configuration

RAID (redundant array of independent disks, originally redundant array of inexpensive disks) is a storage technology that combines multiple disk drive components into a logical unit. Data is distributed across the drives in one of several ways called "RAID levels", depending on what level of redundancy and performance (via parallel communication) is required.

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0
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0

(block-level striping without parity or mirroring) has no (or zero) redundancy. It provides improved performance and additional storage but no fault tolerance.

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,
1
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1

(mirroring without parity or striping), data are written identically to two drives, thereby producing a "mirrored set"; the read request is serviced by either of the two drives containing the requested data, whichever one involves least seek time plus rotational latency.

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,
5
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5

(block-level striping with distributed parity) distributes parity along with the data and requires all drives but one to be present to operate; the array is not destroyed by a single drive failure.

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,
10
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10

Ein RAID-10-Verbund ist ein RAID 0 über mehrere RAID 1. Es werden dabei die Eigenschaften der beiden RAIDs kombiniert: Sicherheit und gesteigerte Schreib-/Lesegeschwindigkeit.
Ein RAID-10-Verbund benötigt mindestens vier Festplatten.

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Expansion slots

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Expansion slots

The expansion card (also expansion board, adapter card or accessory card) in computing is a printed circuit board that can be inserted into an electrical connector, or expansion slot on a computer motherboard, backplane or riser card to add functionality to a computer system via the expansion bus.

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PCI express version (max.)
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PCI express version (max.)

PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe, is a computer expansion card standard designed to replace the older PCI, PCI-X, and AGP bus standards. PCIe has numerous improvements over the aforementioned bus standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance-scaling for bus devices, a more detailed error detection and reporting mechanism, and native hot-plug functionality. More recent revisions of the PCIe standard support hardware I/O virtualization.

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3
PCI Express x16
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PCI Express x16

PCI Express („Peripheral Component Interconnect Express“, abgekürzt: PCIe oder PCI-E) ist ein Erweiterungsstandard zur Verbindung von Peripheriegeräten mit dem Chipsatz eines Hauptprozessors. PCIe ist der Nachfolger von PCI, PCI-X und AGP und bietet im Vergleich zu seinen Vorgängern eine höhere Datenübertragungsrate pro Pin.
Während ihrer Entwicklung wurde die Schnittstelle „3GIO“ genannt, was für „3rd Generation Input/Output“ steht.

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5 x

Expansion slot speed

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Expansion slot speed

Beschreibt die Geschwindigkeiten der PCI-E Slots auf dem Motherboard.

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PCI-E 3.0 x16 (@x16)
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PCI-E 3.0 x16 (@x16)

Describes the count of the PCI-E slots with the slot size of x16 and are wired electrically x16.

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2 x
PCI-E 3.0 x16 (@x8)
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PCI-E 3.0 x16 (@x8)

Describes the count of PCI-E slots with the slot size of x16 and are wired electrically x8.

More information...

3 x

Graphics properties

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Graphics properties

Beschreibt die Grafik Eigenschaften des Gerätes.

Multi-GPU technology
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Multi-GPU technology

In der 3D-Computergrafik werden verschiedene Verfahren zur Lastverteilung der Rechenarbeit auf mehrere Grafikchips oder Grafikkarten eingesetzt. Der Sammelbegriff für diese unterschiedlichen Techniken lautet Multi-GPU. Obwohl jeder Hersteller ähnliche Betriebsmodi anbietet, ist der Name der jeweiligen Technik eine spezielle Marketing-Wortschöpfung.

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NVIDIA Quad-SLI
,
AMD Quad-GPU CrossFireX

Network

RJ45/LAN port
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RJ45/LAN port

Netzwerkanschluss erlaubt die Verbindung mit einem internen oder externen Netzwerk.

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1 x
Max. port speed
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Max. port speed

Describes the maximum data transfer rate. Is not necessarily supported by all ports.

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1000 Mbit/s
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1000 Mbit/s

In computer networking, Gigabit Ethernet (GbE or 1 GigE) is a term describing various technologies for transmitting Ethernet frames at a rate of a gigabit per second (1,000,000,000 bits per second).

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Ethernet controller brand
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Ethernet controller brand

Beschreibt die Marke des eingebauten Ethernet Controllers.

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Intel
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Intel

Intel Corporation is an American multinational semiconductor chip maker corporation headquartered in Santa Clara, California.

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Wireless connectivity

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Wireless connectivity

All network connectivity bluetooth, infrared ports, WLAN, UMTS etc.
Standards are listed here as well.

Wi-Fi
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Wi-Fi

A wireless local area network (WLAN) links two or more devices using some wireless distribution method (typically spread-spectrum or OFDM radio), and usually providing a connection through an access point to the wider Internet.

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Yes
Wi-Fi standard
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Wi-Fi standard

Describes the supported modes of transmission of a WLAN.

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802.11 ac
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802.11 ac

Im Jahr 2013 soll der neue Standard 802.11ac verabschiedet werden. Hauptvorteil gegenüber 802.11n ist die schnellere Datenübertragung mit einer Bruttodatenrate bis zu 6900MBit/s. Netto schaffen gute Geräte aber immerhin das dreifache der 3-Stream-MiMO-Geräte. Die Datenübertragung geschieht ausschliesslich im 5-GHz-Band und fordert eine grössere Kanalbreite von 80 MHz, optional eine Kanalbreite von 160 MHz.

More information...

,
802.11 b
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802.11 b

IEEE 802.11b-1999 or 802.11b, is an amendment to the IEEE 802.11 specification that extended throughput up to 11 Mbit/s using the same 2.4 GHz band.

More information...

,
802.11 g
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802.11 g

IEEE 802.11g-2003 or 802.11g is an amendment to the IEEE 802.11 specification that extended throughput to up to 54 Mbit/s using the same 2.4 GHz band as 802.11b.

More information...

,
802.11 n
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802.11 n

IEEE 802.11n-2009 is an amendment to the IEEE 802.11-2007 wireless networking standard to improve network throughput over the two previous standards—802.11a and 802.11g—with a significant increase in the maximum net data rate from 54 Mbit/s to 600 Mbit/s (slightly higher gross bit rate including for example error-correction codes, and slightly lower maximum throughput) with the use of four spatial streams at a channel width of 40 MHz.802.11n standardized support for multiple-input multiple-output and frame aggregation, and security improvements, among other features.

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Bluetooth
i

Bluetooth

The device can be connected to another device via Bluetooth.

Yes

Audio

Chip
Realtek ALC1150
Audio channel
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Audio channel

The descriptions of audio sound specifications distinguish between the number of discrete channels encoded in the original signal and the number of channels reproduced for playback.

7.1 Channel
Audio (3. 5 mm) connectors
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Audio (3. 5 mm) connectors

Es sind 3.5mm Audioanschlüsse vorhanden. (Mindestens Audio Output).

5 x
Optical TOSLINK
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Optical TOSLINK

S/PDIF (Sony/Philips Digital Interconnect Format) is a type of digital audio interconnect cable used in consumer audio equipment to output audio over reasonably short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.

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1 x

Internal interfaces

USB 3.0 type A
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USB 3.0 type A

The universal serial bus (USB) is a serial bus system for the connection of a computer to external devices. USB3.0 can reach up to 5 Gbit/s in Superspeed modus.

More information...

2 x
USB 2.0 type A
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USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

More information...

2 x
Number of fan connector
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Number of fan connector

Beschreibt wie viele Lüfterstecker auf dem Motherboard vorhanden sind.

More information...

6

Power supply

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Power supply

All power supply related details.

Power connectors
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Power connectors

Beschreibt wie viele Stromanschlüsse das Gerät/Objekt hat/benötigt.

More information...

24-pin ATX
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24-pin ATX

More information...

,
8-pin ATX 12V
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8-pin ATX 12V

More information...

,
4-pin ATX 12V
i

4-pin ATX 12V

More information...

Product dimensions

i

Product dimensions

Physical size of an object

Length
305 mm
Width
272 mm

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Warranty & right to return

Dead on arrival (DOA) 14 Days Bring-in
Warranty 36 month Bring-in
30-day right of return
i

30-day right of return

This product may be returned within 30 days after shipment or collection. A minimum of 10% will be deducted from opened products. Unfortunately, we cannot accept a product if it is damaged, incomplete or missing its original packaging.

Warranty and return

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Warranty extension

Warranty extension Bring-in

Warranty extension Bring-in

The warranty is extended at the same conditions as the manufacturer warranty.

to 5 years CHF 57.40

More information about warranty extensions

Availability

Mail delivery

 only 3 item(s) ready for delivery from our warehouse
Expected delivery date: tomorrow 27.06.2017 if ordered by today 17:00.

Collection

Basel

 Ready for collection approx tomorrow at 13:10 if ordered by tomorrow 07:20
3 item(s) at our central warehouse

Bern

 Ready for collection approx tomorrow at 12:45 if ordered by tomorrow 05:45
3 item(s) at our central warehouse

Dietikon

 Ready for collection approx tomorrow at 14:30 if ordered by tomorrow 08:45
3 item(s) at our central warehouse

Geneva

 Ready for collection approx tomorrow at 13:30 if ordered by tomorrow 03:45
3 item(s) at our central warehouse

Kriens

 Ready for collection approx tomorrow at 11:20 if ordered by tomorrow 06:45
3 item(s) at our central warehouse

Lausanne

 Ready for collection approx tomorrow at 15:40 if ordered by tomorrow 05:45
3 item(s) at our central warehouse

St Gallen

 Ready for collection approx tomorrow at 15:30 if ordered by tomorrow 08:10
3 item(s) at our central warehouse

Winterthur

 Ready for collection approx tomorrow at 13:30 if ordered by tomorrow 08:10
3 item(s) at our central warehouse

Wohlen

 only 3 piece(s) ready for pick up
Ready for collection immediately after ordering.

Zurich

 Ready for collection approx today at 17:30 if ordered by today 13:15
3 item(s) at our central warehouse

PickMup

 only 3 item(s) ready for delivery from our warehouse
Expected delivery date: tomorrow 27.06.2017 if ordered by today 17:00. What is PickMup?

If ordered immediately.
Information subject to change.

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MSI X99A Xpower Gaming Titanium (LGA 2011-v3, Intel X99, E-ATX) MSI X99A Xpower Gaming Titanium (LGA 2011-v3, Intel X99, E-ATX)