Name: XEON W2123 3.6GHZ
Brand: Intel
SKU: 10092152
Price: 371.9 CHF
Availability: InStock

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Intel

With Intel virtualization technology (VT-x), a hardware platform can be used as multiple "virtual" platforms. It offers improved manageability through reduced downtime and maintains productivity by shifting computing tasks into separate partitions.

The Intel Transactional Synchronization Extensions New Instructions (Intel TSX-NI) are a set of instructions designed for multithread performance scaling. This technology enhances efficiency in parallel operations through improved control of locks in software.

The enhanced Intel SpeedStep technology is an advanced feature that provides the necessary combination of high performance and low power consumption for mobile devices. The traditional Intel SpeedStep technology adjusts voltage and frequency simultaneously between high and low values based on processor load. The enhanced Intel SpeedStep technology builds on this architecture and utilizes design strategies such as separating voltage and frequency changes, as well as clock partitioning and recovery.

Actual product image Intel XEON W2123 3.6GHZ (LGA 2066, 3.60 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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