Name: Xeon W W7-2495X - 2.5 GHz - 24 Ker
Brand: Intel
SKU: 36016681
Price: 2181 CHF
Availability: InStock

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Intel

The Intel Xeon W W7-2495X is a powerful processor designed for demanding applications and workloads. With a base clock speed of 2.5 GHz and the ability to reach up to 4.8 GHz in Turbo mode, this processor delivers impressive performance for professional applications. It features 24 cores and supports 48 threads, enabling efficient processing of multiple tasks simultaneously. The processor is equipped with 45 MB of cache memory, which enhances data processing speed and optimizes overall performance. The Xeon W W7-2495X is intended for use in servers and workstations and supports a variety of Intel technologies that improve data processing security and efficiency. With a manufacturing process of 10 nm and support for quad-channel memory, this processor offers high energy efficiency and performance.

- Maximum TDP of 270 watts for high performance under load
- Support for up to 2000 GB of RAM for extensive applications
- Hyper-Threading technology for enhanced multitasking capabilities
- Intel Turbo Boost Technology 2.0 for dynamic performance adjustment
- Compatibility with LGA 4677 socket for easy integration into existing systems.

Actual product image Intel Xeon W W7-2495X - 2.5 GHz - 24 Ker (LGA 4677, 2.50 GHz, 24 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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Intel Xeon W W7-2495X - 2.5 GHz - 24 Ker

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Intel Xeon W W7-2495X - 2.5 GHz - 24 Ker

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