Name: Xeon Silver 4116
Brand: Intel
SKU: 6417461
Price: 1131.15 CHF
Availability: InStock

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Intel

The Intel Xeon Silver 4116 is a powerful processor designed for server applications and demanding data processing tasks. With a clock speed of 2.1 GHz and the ability to handle up to 24 threads simultaneously, this processor provides a solid foundation for multitasking and parallel processing. It supports up to 768 GB of DDR4 RAM across six memory channels, ensuring high memory capacity and speed. The architecture of the Xeon Silver 4116 is based on Skylake-SP technology and utilizes a 14 nm lithography to deliver efficient performance with a Thermal Design Power (TDP) of 85 W. Additionally, the processor is equipped with advanced virtualization and security features, making it ideal for use in modern data centers.

- Supports up to 768 GB of DDR4 RAM via hexa-channel memory architecture
- Offers 12 cores and 24 threads for enhanced multitasking capabilities
- Integrated Intel® Trusted Execution Technology for increased security
- Compatible with Intel® Directed I/O Virtualization Technology (VT-d)
- Maximum Turbo frequency of up to 3 GHz for additional performance when needed.

Actual product image Intel Xeon Silver 4116 (LGA 3647, 2.10 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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