Name: Xeon Gold 6248
Brand: Intel
SKU: 19457088
Price: 1120.95 CHF
Availability: InStock

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Intel

Intel Xeon Gold 6248 - 2.5 GHz - 20 cores - 40 threads - 27.5 MB cache memory - LGA3647 socket - OEM Group Processor. 

Product Description: Intel Xeon Gold 6248 / 2.5 GHz Processor. 

Product Type: Processor. 
Processor Type: Intel Xeon Gold 6248. 
Number of Cores: 20 cores / 40 threads. 
Cache Memory: 27.5 MB. 
Compatible Processor Connector: LGA3647 Socket. 
Processor Instance: 1. 
Clock Frequency: 2.5 GHz. 
Max Turbo Speed: 3.9 GHz. 
Manufacturing Process: 14 nm. 

Features: Enhanced SpeedStep technology, Hyper-Threading Technology, support for Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel Trusted Execution Technology, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Intel Virtualization Technology for Directed I/O (VT-d), Intel vPro Technology, Intel VT-x with Extended Page Tables (EPT), Intel TSX-NI, Intel Speed Shift Technology.

Actual product image Intel Xeon Gold 6248 (LGA 3647, 2.50 GHz, 20 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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