Name: Xeon E5-2650V4 processor Smart Cache
Brand: Intel
SKU: 17958974
Price: 130.8 CHF
Availability: InStock

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Intel

The powerful new family of Intel Xeon E5-2600 v4 processors offers versatility for a wide range of workloads. These processors are designed for next-generation data center architectures based on software-defined infrastructure, providing outstanding characteristics in terms of efficiency, performance, and agile service delivery across native cloud and traditional applications. They are suitable for various workloads, from cloud computing to high-performance computing, networking, and data storage.

Performance  
Based on 14nm process technology, the Intel Xeon E5 v4 processors deliver enhanced performance features with up to 22 cores/44 threads and 55 MB of last-level cache (LLC) per socket, providing more power for parallel applications with Intel Transactional Synchronization Extensions (Intel TSX).

Optimized Orchestration  
With Intel Resource Director Technology (Intel RDT) – which includes cache monitoring and cache allocation techniques, code and data prioritization, and memory bandwidth monitoring – shared resources can be managed more effectively and resource utilization can be improved.

Enhanced Security  
Thanks to accelerated cryptographic performance, encrypted data can be transmitted quickly over secure connections. Additionally, improved security keys help protect network access and provide deeper platform protection.

Actual product image Intel Xeon E5-2650V4 processor Smart Cache (LGA 2011, 2.20 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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