Name: Xeon E5-1650 v4
Brand: Intel
SKU: 6195830
Rating: 5 (1 reviews)

isSSR

offer

olderThan3MonthTimestamp

path

sectorId

shopArea

slug

tagIds

productDetailPageQuery

productBySlug

alternateLinks

dutchAuctionBannerLazy

alternateLinksByPath

currentAuctionEvent

Intel

The Intel Xeon E5-1650 v4 is a powerful processor designed for demanding workstation applications. With a base clock speed of 3.6 GHz and the ability to reach up to 4 GHz in Turbo mode, this processor delivers high computational power for multithreading applications. It features 6 cores and supports 12 threads, allowing for efficient processing of multiple tasks simultaneously. The Xeon E5-1650 v4 is equipped with a generous 15 MB cache, further optimizing data processing speed. The processor is designed for the LGA 2011-v3 socket and supports quad-channel memory with a maximum capacity of 1536 GB, making it ideal for memory-intensive applications. With a Thermal Design Power (TDP) of 140 W, it is suitable for use in high-performance systems that require reliable cooling. The support for modern instruction sets such as AVX 2.0 and integrated virtualization technology makes it a versatile choice for professional users.

- Maximum Turbo clock speed of 4 GHz for additional performance
- Support for up to 1536 GB of DDR4 SDRAM
- Hyper-Threading technology for enhanced multitasking capabilities
- Integrated virtualization techniques (VT-x, VT-d) for optimized server applications
- 14 nm lithography for improved energy efficiency and performance.

Actual product image Intel Xeon E5-1650 v4 (LGA 2011-v3, 3.60 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Search

Intel Xeon E5-1650 v4

Product details

Compare products

Goes with

Reviews & Ratings

Intel Xeon E5-1650 v4

Similar products with faster delivery

Product details

Description

Specifications

Price trend

Compare products

Sales rank in Processors

Goes with

Accessories

Reviews & Ratings

Warranty & return rates

Questions about this product

Product ratings1