Name: Xeon E-2286G 4 GHz
Brand: Intel
SKU: 21653484
Price: 488.93 CHF
Availability: InStock

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Intel

The Intel Xeon E-2286G processor is a powerful and versatile solution for demanding applications in digital office and server environments. With a base clock frequency of 4 GHz and the ability to reach up to 4.9 GHz in Turbo mode, this processor offers high computing power for multitasking and compute-intensive tasks. It features 6 cores and supports 12 threads, enabling efficient processing of multiple tasks simultaneously. Support for DDR4 RAM and a maximum memory capacity of 128 GB make it ideal for memory-intensive applications. Additionally, the processor is equipped with integrated graphics, providing extra flexibility in utilizing graphics resources. Intel technologies, such as Trusted Execution Technology and virtualization techniques, contribute to security and efficiency in virtualized environments, making it an excellent choice for businesses that rely on security and performance.

- Intel® Trusted Execution Technology for enhanced security
- Intel® Directed I/O Virtualization Technology (VT-d) to improve I/O device virtualization
- Intel® Virtualization Technology (VT-x) for improved manageability and productivity
- Maximum Turbo frequency of 4.9 GHz for additional performance
- Support for up to 128 GB DDR4 RAM for memory-intensive applications.

Actual product image Intel Xeon E-2286G 4 GHz (LGA 1151, 4 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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