Name: CPU/Xeon E-2486 6 Core 3.5GHz LGA16A
Brand: Intel
SKU: 41292019
Price: 586.81 CHF
Availability: InStock

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Intel

The Intel Xeon E-2486 is a powerful hexa-core processor designed for server and enterprise applications. With a base clock speed of 3.5 GHz and a maximum turbo frequency of up to 5.6 GHz, this processor delivers impressive performance for demanding tasks. It features 6 cores and 12 threads, enabling efficient multitasking. The LGA 1700 socket allows for easy integration into modern server architectures. With an 18 MB cache and support for up to 128 GB of DDR5 RAM at a speed of 4800 MHz, the Xeon E-2486 is ideal for applications that require high data processing rates. Its power consumption of 95 W also makes it an energy-efficient choice for data centers and server environments.

- Maximum turbo frequency of 5.6 GHz for additional performance when needed
- Supports dual-channel memory with up to 128 GB of DDR5 RAM
- PCI Express version 5 for high data transfer rates
- Integrated hyper-threading technology to enhance multithreading performance
- 7 nm lithography for improved energy efficiency and performance.

Actual product image Intel CPU/Xeon E-2486 6 Core 3.5GHz LGA16A (LGA 1700, 3.50 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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