Name: Core Ultra 7 265, Core Ultra 7, FCLGA1851,, 64-bit, Core Ultra (Series 2), 5
Brand: Intel
SKU: 53974722
Price: 335 CHF
Availability: InStock

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Intel

The Intel Core Ultra 7 processor integrates advanced technologies to enhance performance and security. With Smart Cache technology, it efficiently manages data, resulting in higher processing speeds. Features like Intel Quick Sync Video enable seamless multimedia experiences, while support for virtualization ensures optimal resource management. With numerous security features such as Intel Secure Key and Intel Boot Guard, this processor offers protection against threats. It is designed for high-performance computing and includes Intel Advanced Vector Extensions 2 (AVX2.0) and Intel Deep Learning Boost (DL Boost) to accelerate workloads, from data analysis to AI applications. This processor is a reliable choice for users seeking improved performance and security in their computing tasks.

Actual product image Intel Core Ultra 7 265, Core Ultra 7, FCLGA1851,, 64-bit, Core Ultra (Series 2), 5 (LGA 1851, 2.40 GHz, 20 -Core)

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Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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