Name: Core i9-9900KS
Brand: Intel
SKU: 12178745
Rating: 4.87 (15 reviews)

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Intel

In combination with an Intel Core i9-9900K processor, the Intel Z390 chipset impresses with high speed and strong performance without further fine-tuning. For those with even higher demands, it offers versatile tuning options. The Intel Core processors with a K suffix are particularly aimed at overclockers and provide additional headroom thanks to their unlocked multipliers. They are also designed for a higher TDP. Gain more performance exactly when you need it. Thanks to Turbo Boost and optimized SpeedStep technology, the processor quickly adjusts its clock rate to the workload, always finding the right balance between energy consumption and performance. Intel's ninth-generation Core processors are manufactured using the 14nm++ process. According to Intel, this allows for up to 26% more performance with approximately 50% lower power consumption. The graphics solution remains largely the same compared to the seventh and eighth generations, still allowing features that were previously reserved for dedicated graphics cards – from video and photo editing to gaming and 4K video playback.

Actual product image Intel Core i9-9900KS (LGA 1151, 4 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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