Name: Core i9-14900F
Brand: Intel
SKU: 41791730
Price: 545 CHF
Availability: InStock

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Intel

The Intel Core i9-14900F processor belongs to the 14th generation of the Intel Core series and offers a powerful solution for demanding applications and gaming. With a combination of 24 cores and 32 threads, this processor enables efficient multitasking. The base clock frequency of 2 GHz can be boosted to up to 5.8 GHz through Turbo Boost technology, ensuring outstanding performance in compute-intensive applications. The processor supports the latest PCI Express version 5 and is equipped with an LGA 1700 socket, making it future-proof for upcoming hardware upgrades. With a maximum Thermal Design Power (TDP) of 65 watts, the i9-14900F is also energy-efficient, making it an ideal choice for high-performance desktop systems. Support for DDR5 RAM and a large cache size of 36 MB ensure fast data processing and improved system performance.

- 24 cores and 32 threads for high multitasking performance
- Maximum Turbo clock frequency of 5.8 GHz for peak performance
- Support for PCI Express version 5 for fast data transfer
- Maximum RAM capacity of 192 GB for extensive applications
- Energy-efficient 65 watts TDP for optimized performance.

Actual product image Intel Core i9-14900F (LGA 1700, 2 GHz, 24 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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Intel Core i9-14900F

CHF552.07

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CHF552.07

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