Name: Core i9-10900KF
Brand: Intel
SKU: 12927645
Price: 370 CHF
Availability: InStock
Rating: 4.78 (92 reviews)

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Intel

The Intel Core i9-10900KF is a powerful 10th generation processor designed for demanding applications and gaming. With a base clock speed of 3.7 GHz and a maximum turbo frequency of up to 5.3 GHz, this processor delivers impressive performance for multitasking and compute-intensive tasks. It features 10 cores and 20 threads, allowing for efficient processing of parallel tasks. The i9-10900KF supports dual-channel memory and can manage up to 128 GB of RAM, making it ideal for applications that require high memory capacities. The 14nm lithography enhances energy efficiency, while the thermal design power (TDP) of 125W necessitates adequate cooling. This processor is suitable not only for gamers but also for content creators and professional users who rely on high performance.

- Maximum turbo frequency of 5.3 GHz for additional performance when needed
- Supports up to 128 GB of DDR4 RAM for extensive applications
- 10 cores and 20 threads enable efficient multitasking
- Compatible with LGA 1200 socket for easy integration into existing systems
- Integrated technologies such as Hyper-Threading and Turbo Boost for enhanced performance.

Actual product image Intel Core i9-10900KF (LGA 1200, 3.70 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Condition	As good as new
Warranty	No warranty

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