Name: Core i7-9700K
Brand: Intel
SKU: 9598352
Rating: 4.81 (408 reviews)

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Intel

The Intel Core processors of the ninth generation are named Coffee Lake-S Refresh. One of the biggest innovations is that the CPUs with an unlocked multiplier now feature a soldered heat spreader (IHS). This allows for more efficient heat dissipation from the CPU, enabling higher clock rates over a longer period.

The Intel Core i7-9700K is the new high-end model of the Core 9000 series and features eight cores. The processor also impresses with increased clock rates and optimized boost functions compared to its predecessors. The TDP of this eight-core processor is only 95 watts. The processor is compatible with Socket 1151 motherboards of the 300 series.

Actual product image Intel Core i7-9700K (LGA 1151, 3.60 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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