Name: Core i7-12700KF Tray
Brand: Intel
SKU: 19620467
Price: 203 CHF
Availability: InStock
Rating: 5 (4 reviews)

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Intel

The Intel Core i7-12700KF is a powerful 12th generation processor optimized for demanding applications and multitasking. With 12 cores and 20 threads, it delivers excellent performance for gaming, content creation, and professional applications. The base clock frequency of 3.6 GHz can be boosted to up to 5 GHz through Turbo Boost technology, allowing for dynamic performance adjustment. The processor supports Intel 64 architecture, enabling 64-bit processing and access to more than 4 GB of RAM. With a generous 25 MB L3 cache and support for DDR4 RAM up to 128 GB, the i7-12700KF is ideal for memory-intensive applications. The integrated virtualization technology (VT-x and VT-d) enhances efficiency in virtualized environments, providing improved security and performance. The processor is designed for the LGA 1700 socket and has a maximum TDP of 190 watts, making it an excellent choice for high-performance desktop systems.

- 12 cores and 20 threads for high multitasking performance
- Maximum Turbo clock frequency of 5 GHz for dynamic performance
- Support for DDR4 RAM up to 128 GB
- Intel virtualization technologies (VT-x and VT-d) for improved efficiency
- 25 MB L3 cache for faster data access.

Actual product image Intel Core i7-12700KF Tray (LGA 1700, 3.60 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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