Name: Core I5 14500
Brand: Intel
SKU: 42057579
Price: 220.19 CHF
Availability: InStock

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Intel

The Intel Core i5-14500 is a powerful processor designed for modern computer applications. With 14 cores, consisting of 6 performance cores and 8 efficiency cores, this processor offers high processing power and efficiency. The base frequency of 2.6 GHz can be boosted up to 5.0 GHz through Turbo Boost technology, making it ideal for demanding tasks such as gaming, content creation, and multitasking. The processor supports the LGA 1700 socket and is part of the Intel Core i5-14xxx generation, based on the Raptor Lake architecture. With 20 threads and a 24 MB Smart Cache, the i5-14500 enables smooth execution of multiple applications simultaneously. Additionally, it supports dual-channel memory with a maximum bandwidth of 76.8 GB/s, further enhancing the overall system performance.

- 14 cores (6 P-cores + 8 E-cores) for improved performance and efficiency
- Maximum turbo frequency of 5.0 GHz for demanding applications
- 24 MB Smart Cache for optimized data processing
- Supports dual-channel memory with up to 192 GB RAM
- Integrated Intel UHD Graphics 770 for basic graphics processing.

Actual product image Intel Core I5 14500 (LGA 1700, 2.60 GHz, 14 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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