Name: SKL XEON-G 5118 2.3G 12C 105W
Brand: HPE
SKU: 18076285
Price: 2335 CHF
Availability: InStock

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The SKL XEON-G 5118 processor from Hewlett Packard Enterprise is a powerful CPU designed for demanding server and workstation applications. With a base clock frequency of 2.3 GHz and the ability to reach up to 3.2 GHz in Turbo mode, this processor delivers high computing power for parallel processing tasks. The 12 cores and 24 threads enable efficient handling of multiple tasks simultaneously, making it ideal for virtualization, data analysis, and other compute-intensive applications. The processor supports DDR4 RAM and offers a maximum memory capacity of 768 GB, ensuring high flexibility and performance in memory-intensive environments. With a maximum Thermal Design Power (TDP) of 105 watts, the SKL XEON-G 5118 is energy-efficient and well-suited for use in modern data centers.

- Processor socket: LGA 3647
- Max. Turbo clock frequency: 3.2 GHz
- Supports Hexa-Channel DDR4 RAM
- Maximum memory of 768 GB
- Processor architecture: 64-bit.

Actual product image HPE SKL XEON-G 5118 2.3G 12C 105W (LGA 3647, 2.30 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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