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The HPE Xeon processor with a clock speed of 2.8 GHz is a powerful solution for server applications. With a 32-bit architecture and support for Hyper-Threading technology, this processor offers enhanced multitasking capabilities that are crucial for demanding server environments. The processor is equipped with a 512 MB L3 cache and a 512 MB L2 cache, optimizing data processing speed. It is deployed via Socket 603, allowing for easy integration into existing systems. With a maximum Thermal Design Power (TDP) of 74 watts, the processor is energy-efficient, making it suitable for environments where power consumption and heat generation are critical. The HPE Xeon processor is a reliable choice for companies seeking stable performance and efficiency in their server solutions.

- 1 processor core for targeted performance
- Maximum TDP of 74 watts for energy efficiency
- 512 MB L3 cache to enhance data processing
- Support for Hyper-Threading for optimized multitasking
- Compatible with Socket 603 for easy integration.

Actual product image HPE PROC,2.8GHZ,W/HTSK XEON 400MHZ (Socket 603, 2.80 GHz, 1 -Core)

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Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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HPE PROC,2.8GHZ,W/HTSK XEON 400MHZ

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