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The PROC Xeon E3-1225V6 is a powerful processor from HP Inc., designed for demanding applications and server environments. With a base clock frequency of 3.3 GHz and a maximum turbo frequency of 3.7 GHz, this processor delivers high computing power suitable for multitasking and compute-intensive tasks. The Xeon E3-1225V6 features four processor cores and supports four threads, enabling efficient data processing. The dual-channel memory architecture and support for up to 64 GB of RAM enhance memory bandwidth and performance. With a maximum thermal design power (TDP) of 73 watts, this processor is energy-efficient and well-suited for use in servers and workstations. The 14-nanometer lithography improves energy efficiency and performance, while the 8 MB L3 cache increases data processing speed. The processor is compatible with the LGA 1151 socket and supports PCI Express version 3, allowing for flexible expansion and connectivity to various components.

- Maximum turbo frequency of 3.7 GHz for additional performance when needed
- Supports dual-channel memory architecture for improved bandwidth
- Maximum RAM of 64 GB for demanding applications
- Energy-efficient 14-nanometer lithography
- Compatible with LGA 1151 socket for easy integration.

Actual product image HP PROC Xeon E3-1225V6 3.3GHz xxW (LGA 1151, 3.30 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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