Quantity discount
Genesis Silicone thermal compound /m-K
8.30 W/m K, 0.50 gDelivered between Thu, 22.5. and Sat, 31.5.
More than 10 items in stock at supplier
More than 10 items in stock at supplier
Product details
The Genesis Silicon 701 thermal paste is a high-performance thermal grease specifically designed for efficient heat transfer between electronic components. With a thermal conductivity of 8.3 W/m·K, this paste ensures effective heat dissipation, enhancing the performance and lifespan of devices. The paste is gray in color and is offered in a convenient 0.5 g packaging that allows for easy application. It is ideal for use in computers, graphics cards, and other electronic devices where optimal heat dissipation is required. The density of 1.6 g/cm³ ensures even distribution and a reliable connection between surfaces. Please pay attention to the safety and hazard warnings to ensure safe handling.
- Thermal conductivity of 8.3 W/m·K for optimal heat transfer
- Density of 1.6 g/cm³ for even distribution
- Convenient 0.5 g packaging for easy application
- Signal word WARNING with health hazard GHS07.
Weight | 0.50 g |
Item number | 15683040 |
Manufacturer | Genesis |
Category | Thermal grease |
Manufacturer no. | NTG-1582 |
Release date | 16.4.2021 |
Thermal paste type | Heat sink compound |
Thermal conductivity | 8.30 W/m K |
Density | 1.60 g/cm³ |
Country of origin | Poland |
CO₂-Emission | |
Climate contribution |
Content | 0.20 ml |
Weight | 0.50 g |
Length | 10.80 cm |
Width | 3.20 cm |
Height | 1.20 cm |
Weight | 11 g |
Specifications may include unverified machine translations.

- H318 Causes serious eye damage.
- H315 Causes skin irritation.
30-day right of return if unopened