Dynatron J2 AMD SP5 1U passive heat sink with copper vapour chamber and fin stack up to 300W TD

The Dynatron J2 AMD SP5 1U passive cooler is a highly advanced cooling solution specifically designed for use with the SP5 processor socket. This passive cooler utilizes innovative copper vapor chamber technology to ensure efficient heat dissipation. With a maximum thermal design power (TDP) of up to 300 W, it is ideal for high-performance applications where reliable cooling is essential. The cooler is designed in a compact 1U format, making it particularly suitable for use in server and rack systems. The use of high-quality copper as the cooling material ensures effective heat transfer, while the pre-applied thermal paste from Shin-Etsu 7762 allows for easy installation. Weighing 642 g, the cooler features a robust construction that ensures durability and stability.

• Maximum TDP of up to 300 W for high performance
• Copper vapor chamber for efficient heat dissipation
• Pre-applied thermal paste for easy installation
• Compact 1U design for space-saving use.