Delock 18467 - thermal pad 70 x 20 x 1.75 mm for M.2 modules 3.2 WmK - Low Oil Bleeding

This thermal pad from Delock is suitable for heat dissipation, for example on an M.2 module. The purpose of the pad is to enhance performance and increase the lifespan of components.

Low oil bleed: This pad has a particularly low oil bleed, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with "Low Oil Bleeding" maintain their thermal and mechanical properties better, ensuring consistent and stable heat dissipation.

Technical specifications:

• Thermal pad for heat dissipation
• Low oil bleed
• Thermal conductivity: 3.2 W/mK
• Operating temperature: -60 °C to 180 °C
• Color: gray
• Dimensions (LxWxH): approx. 70 x 20 x 1.75 mm

Package contents:

• 1 x thermal pad

Packaging:

• Resealable bag.