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Delock 18467 - thermal pad 70 x 20 x 1.75 mm for M.2 modules 3.2 WmK - Low Oil Bleeding
1.75 mm, 3.20 W/m KDelivered between Fri, 17.4. and Wed, 6.5.
More than 10 pieces in stock at supplier
More than 10 pieces in stock at supplier
Free shipping starting at 50.–
Product details
This thermal pad from Delock is suitable for heat dissipation, for example on an M.2 module. The purpose of the pad is to enhance performance and increase the lifespan of components.
Low oil bleed: This pad has a particularly low oil bleed, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with "Low Oil Bleeding" maintain their thermal and mechanical properties better, ensuring consistent and stable heat dissipation.
Technical specifications:
- Thermal pad for heat dissipation
- Low oil bleed
- Thermal conductivity: 3.2 W/mK
- Operating temperature: -60 °C to 180 °C
- Color: gray
- Dimensions (LxWxH): approx. 70 x 20 x 1.75 mm
Package contents:
- 1 x thermal pad
Packaging:
- Resealable bag.
Max. temperature | 180 °C |
Density | 3.20 g/cm³ |
Length | 70 mm |
Width | 20 mm |
Thickness | 1.75 mm |
Item number | 57834152 |
Manufacturer | Delock |
Category | Thermal pads |
Manufacturer no. | 18467 |
Release date | 16.4.2025 |
Colour | Grey |
Material | Silicone |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 3.20 W/m K |
Max. temperature | 180 °C |
Density | 3.20 g/cm³ |
Items per sales unit | 1x |
Country of origin | China, Taiwan |
CO₂ emissions | 16.89 kg |
Climate contribution | CHF 0.24 |
Length | 70 mm |
Width | 20 mm |
Thickness | 1.75 mm |
Specifications may include unverified machine translations.
30-day right of return
24 Months Warranty (Bring-in)
2 additional offers