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CHF 359.–

ASUS MAXIMUS IX FORMULA (LGA 1151, Intel Z270, ATX)

Art-Nr 6067159
 approx. 4–6 days > 5 item(s) ready for shipment from external warehouse

Availability

Mail delivery

  • approx. 4–6 days
    > 5 item(s) ready for shipment from external warehouse

Collection

  • All locations: approx. 5–7 days
    Currently > 5 piece(s) in stock at the supplier

If ordered immediately.
Information subject to change.

View details

6

Specifications

Key specifications

PCI express version (max.)3
Multi-GPU technologyNVIDIA SLI, AMD 3-Way CrossFireX

General information

Manufacturer ASUS
Product type Motherboards
i

Motherboards

In personal computers, a motherboard is the central printed circuit board (PCB) in many modern computers and holds many of the crucial components of the system, providing connectors for other peripherals. The motherboard is sometimes alternatively known as the mainboard, system board, or, on Apple computers, the logic board. It is also sometimes casually shortened to mobo.

More information...

Item number6067159
Manufacturer no.90MB0RX0-M0EAY0
Release date05.01.2017
Sales rank in Product type Motherboards14 of 350
External links Manufacturer's site (en)

Motherboard properties

Form factor
i

Form factor

In der Computertechnik ist der Formfaktor eine Angabe über Größe und Befestigungsmöglichkeiten eines Bauteils, das in einem Computer Verwendung findet. Durch diese Standardisierung können verschiedene Komponenten einfach zusammengefügt und ausgetauscht werden.

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ATX
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ATX

ATX (Advanced Technology eXtended) is a motherboard form factor specification developed by Intel in 1995 to improve on previous de facto standards like the AT form factor.

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CPU socket
i

CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

More information...

LGA 1151
Chipset
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Chipset

Der Chipsatz unterstützt den Prozessor bei seiner Aufgabe.

More information...

Intel Z270
BIOS Flashback
i

BIOS Flashback

Einfache Möglichkeit um das BIOS in den Ursprungszustand zu versetzen.

More information...

Yes
R.O.G. Connect
Yes
SuperSpeed USB 3.0
i

SuperSpeed USB 3.0

USB 3.0 is the second major revision of the Universal Serial Bus (USB) standard for computer connectivity. The standard from 2008 defines a 5 Gbit/s transfer rate.

More information...

Yes
UEFI BIOS
i

UEFI BIOS

The Unified Extensible Firmware Interface (UEFI) is a specification that defines a software interface between an operating system and platform firmware. UEFI is meant as a replacement for the Basic Input/Output System (BIOS) firmware interface, present in all IBM PC-compatible personal computers. In practice, most UEFI images have legacy support for BIOS services. UEFI can be used to allow remote diagnostics and repair of computers, even without another operating system.

More information...

Yes

Processor compatibility

Processor family
i

Processor family

The family the processor belongs to.

Core i7 6th Gen
,
Core i5 7th Gen
,
Core i7 7th Gen
,
Intel Core i3 7th Gen

Memory

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Memory

Computer data storage, often called storage or memory, is a technology consisting of computer components and recording media used to retain digital data. It is a core function and fundamental component of computers.

More information...

Number of memory modules
i

Number of memory modules

Ein Speichermodul oder Speicherriegel ist eine kleine Leiterplatte, auf der mehrere Speicherbausteine (Dynamisches RAM in Form von integrierten Schaltkreisen) aufgelötet sind. Speichermodule bilden oder erweitern den Arbeitsspeicher elektronischer Geräte wie Computer oder Drucker und werden dort in speziell dafür vorgesehene Steckplätze gesteckt.

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4 x
Max. memory
i

Max. memory

Ein Datenspeicher oder Speichermedium dient zur Speicherung von Daten beziehungsweise Informationen. Der Begriff Speichermedium wird auch als Synonym für einen konkreten Datenträger verwendet.

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64 GB
Memory chip
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Memory chip

Random-access memory is a form of computer data storage. A random-access device allows stored data to be accessed directly in any random order. In contrast, other data storage media such as hard disks, CDs, DVDs and magnetic tape, as well as early primary memory types such as drum memory, read and write data only in a predetermined order, consecutively, because of mechanical design limitations. Therefore the time to access a given data location varies significantly depending on its physical location.

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DDR4-2133
Max. RAM OC
i

Max. RAM OC

Describes how much memory can be overclocked (maxium RAM overclocking).

4133 MHz
Memory type
i

Memory type

DDR-SDRAM („Double Data Rate Synchronous Dynamic Random Access Memory“) ist ein Typ von Random Access Memory (RAM), den es aktuell in drei Kategorien gibt. DDR-SDRAM mit 184 Kontakten, DDR2-SDRAM mit 240 Kontakten und DDR3-SDRAM ebenfalls mit 240 Kontakten. Verwendet werden sie hauptsächlich für Speichermodule des DIMM- bzw. SO-DIMM-Standards als Arbeitsspeicher in PCs und Laptops.

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DDR4-RAM
Channel Architektur
RAM buffer
i

RAM buffer

In addition to bandwidth and capacity variants, modules can
1. Optionally implement ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC in their designation.
2. Be "registered", which improves signal integrity (and hence potentially clock speed and physical slot capacity) by electrically buffering the signals at a cost of an extra clock of increased latency. Those modules are identified by an additional R in their designation, whereas non-registered (a.k.a. "unbuffered") RAM may be identified by an additional U in the designation.
3. Be Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion.

unbuffered
Memory form factor
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Memory form factor

A DIMM or dual in-line memory module, comprises a series of dynamic random access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.

The main difference between SIMMs and DIMMs is that DIMMs have separate electrical contacts on each side of the module, while the contacts on SIMMs on both sides are redundant. Another difference is that standard SIMMs have a 32-bit data path, while standard DIMMs have a 64-bit data path.

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DIMM 288

Mass storage controller 1

Data storage controller
Intel Z270
S-ATA III
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S-ATA III

Serial ATA (SATA) is a computer bus interface for connecting host bus adapters to mass storage devices such as hard disk drives and optical drives. Serial ATA 3 can transfer up to 6 Gbit/s.

More information...

6 x
M.2
2 x
RAID configuration
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RAID configuration

RAID (redundant array of independent disks, originally redundant array of inexpensive disks) is a storage technology that combines multiple disk drive components into a logical unit. Data is distributed across the drives in one of several ways called "RAID levels", depending on what level of redundancy and performance (via parallel communication) is required.

More information...

0
i

0

(block-level striping without parity or mirroring) has no (or zero) redundancy. It provides improved performance and additional storage but no fault tolerance.

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,
1
i

1

(mirroring without parity or striping), data are written identically to two drives, thereby producing a "mirrored set"; the read request is serviced by either of the two drives containing the requested data, whichever one involves least seek time plus rotational latency.

More information...

,
5
i

5

(block-level striping with distributed parity) distributes parity along with the data and requires all drives but one to be present to operate; the array is not destroyed by a single drive failure.

More information...

,
10
i

10

Ein RAID-10-Verbund ist ein RAID 0 über mehrere RAID 1. Es werden dabei die Eigenschaften der beiden RAIDs kombiniert: Sicherheit und gesteigerte Schreib-/Lesegeschwindigkeit.
Ein RAID-10-Verbund benötigt mindestens vier Festplatten.

More information...

Expansion slots

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Expansion slots

The expansion card (also expansion board, adapter card or accessory card) in computing is a printed circuit board that can be inserted into an electrical connector, or expansion slot on a computer motherboard, backplane or riser card to add functionality to a computer system via the expansion bus.

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PCI express version (max.)
i

PCI express version (max.)

PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe, is a computer expansion card standard designed to replace the older PCI, PCI-X, and AGP bus standards. PCIe has numerous improvements over the aforementioned bus standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance-scaling for bus devices, a more detailed error detection and reporting mechanism, and native hot-plug functionality. More recent revisions of the PCIe standard support hardware I/O virtualization.

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3
PCI Express x16
i

PCI Express x16

PCI Express („Peripheral Component Interconnect Express“, abgekürzt: PCIe oder PCI-E) ist ein Erweiterungsstandard zur Verbindung von Peripheriegeräten mit dem Chipsatz eines Hauptprozessors. PCIe ist der Nachfolger von PCI, PCI-X und AGP und bietet im Vergleich zu seinen Vorgängern eine höhere Datenübertragungsrate pro Pin.
Während ihrer Entwicklung wurde die Schnittstelle „3GIO“ genannt, was für „3rd Generation Input/Output“ steht.

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3 x
PCI Express x1
i

PCI Express x1

PCI Express, officially abbreviated as PCI-E or PCIe, is a computer expansion card interface format introduced by Intel in 2004. PCI Express was designed to replace the general-purpose PCI expansion bus, the high-end PCI-X bus and the AGP graphics card interface. Unlike previous PC expansion interfaces, rather than being a bus it is structured around point-to-point serial links called lanes.

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3 x

Expansion slot speed

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Expansion slot speed

Beschreibt die Geschwindigkeiten der PCI-E Slots auf dem Motherboard.

More information...

PCI-E 3.0 x16 (@x16)
i

PCI-E 3.0 x16 (@x16)

Describes the count of the PCI-E slots with the slot size of x16 and are wired electrically x16.

More information...

2 x
PCI-E 2.0 x16 (@x4)
i

PCI-E 2.0 x16 (@x4)

Beschreibt den Anteil der PCI-E Slots die mechanisch eine Steckplatzgrösse von x16 haben und elektrisch auch x16 verbunden sind.

More information...

1 x

Graphics properties

i

Graphics properties

Beschreibt die Grafik Eigenschaften des Gerätes.

Multi-GPU technology
i

Multi-GPU technology

In der 3D-Computergrafik werden verschiedene Verfahren zur Lastverteilung der Rechenarbeit auf mehrere Grafikchips oder Grafikkarten eingesetzt. Der Sammelbegriff für diese unterschiedlichen Techniken lautet Multi-GPU. Obwohl jeder Hersteller ähnliche Betriebsmodi anbietet, ist der Name der jeweiligen Technik eine spezielle Marketing-Wortschöpfung.

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NVIDIA SLI
i

NVIDIA SLI

Scalable Link Interface, kurz SLI, ist eine Multi-GPU-Technik von Nvidia, die die Zusammenschaltung von zwei oder mehr Grafikchips zur Leistungssteigerung beim Rendern (SLI Frame Rendering) oder den Einsatz von bis zu vier Bildschirmen (SLI Multi View) ermöglicht.

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,
AMD 3-Way CrossFireX
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AMD 3-Way CrossFireX

AMD CrossFireX (previously known as CrossFire) is a brand name for the multi-GPU solution by Advanced Micro Devices, originally developed by ATI Technologies. The technology allows up to four GPUs to be used in a single computer to improve graphics performance.

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Graphic connectors

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Graphic connectors

Beschreibt, welche Grafikausgänge das Mainboard besitzt.

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DisplayPort
i

DisplayPort

DisplayPort is a digital display interface standard (approved May 2006, current version 1.1a approved on January 11, 2008) put forth by the Video Electronics Standards Association (VESA). It defines a new license-free, royalty-free, digital audio/video interconnect, intended to be used primarily between a computer and its display monitor, or a computer and a home-theater system.

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1 x
HDMI type A receptacle
i

HDMI type A receptacle

The High-Definition Multimedia Interface (HDMI) is a compact audio/video connector interface for transmitting uncompressed digital streams. It represents a digital alternative to consumer analog standards such as Radio Frequency (RF) coaxial cable, composite video, S-Video, SCART, component video, D-Terminal, and VGA.

1 x
HDMI version
i

HDMI version

HDMI devices are manufactured to adhere to various versions of the specification, in which each version is given a number and/or letter, such as 1.0, 1.2, or 1.4b. Each subsequent version of the specification uses the same kind of cable but increases the bandwidth and/or capabilities of what can be transmitted over the cable.

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1.4
DisplayPort version
1.2 x

Network

RJ45/LAN port
i

RJ45/LAN port

Netzwerkanschluss erlaubt die Verbindung mit einem internen oder externen Netzwerk.

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1 x
Max. port speed
i

Max. port speed

Describes the maximum data transfer rate. Is not necessarily supported by all ports.

More information...

1000 Mbit/s
i

1000 Mbit/s

In computer networking, Gigabit Ethernet (GbE or 1 GigE) is a term describing various technologies for transmitting Ethernet frames at a rate of a gigabit per second (1,000,000,000 bits per second).

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Ethernet controller brand
i

Ethernet controller brand

Beschreibt die Marke des eingebauten Ethernet Controllers.

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Intel
i

Intel

Intel Corporation is an American multinational semiconductor chip maker corporation headquartered in Santa Clara, California.

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Ethernet controller
i

Ethernet controller

Beschreibt welcher/welche Ethernet Controller verbaut ist.

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I219V

Wireless connectivity

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Wireless connectivity

All network connectivity bluetooth, infrared ports, WLAN, UMTS etc.
Standards are listed here as well.

Wi-Fi
i

Wi-Fi

A wireless local area network (WLAN) links two or more devices using some wireless distribution method (typically spread-spectrum or OFDM radio), and usually providing a connection through an access point to the wider Internet.

More information...

Yes
Wi-Fi standard
i

Wi-Fi standard

Describes the supported modes of transmission of a WLAN.

More information...

802.11 a
i

802.11 a

IEEE 802.11a-1999 or 802.11a is an amendment to the IEEE 802.11 specification that added a higher data rate of up to 54 Mbit/s using the 5 GHz band. It has seen widespread worldwide implementation, particularly within the corporate workspace. The amendment has been incorporated into the published IEEE 802.11-2007 standard.

More information...

,
802.11 ac
i

802.11 ac

Im Jahr 2013 soll der neue Standard 802.11ac verabschiedet werden. Hauptvorteil gegenüber 802.11n ist die schnellere Datenübertragung mit einer Bruttodatenrate bis zu 6900MBit/s. Netto schaffen gute Geräte aber immerhin das dreifache der 3-Stream-MiMO-Geräte. Die Datenübertragung geschieht ausschliesslich im 5-GHz-Band und fordert eine grössere Kanalbreite von 80 MHz, optional eine Kanalbreite von 160 MHz.

More information...

,
802.11 b
i

802.11 b

IEEE 802.11b-1999 or 802.11b, is an amendment to the IEEE 802.11 specification that extended throughput up to 11 Mbit/s using the same 2.4 GHz band.

More information...

,
802.11 g
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802.11 g

IEEE 802.11g-2003 or 802.11g is an amendment to the IEEE 802.11 specification that extended throughput to up to 54 Mbit/s using the same 2.4 GHz band as 802.11b.

More information...

,
802.11 n
i

802.11 n

IEEE 802.11n-2009 is an amendment to the IEEE 802.11-2007 wireless networking standard to improve network throughput over the two previous standards—802.11a and 802.11g—with a significant increase in the maximum net data rate from 54 Mbit/s to 600 Mbit/s (slightly higher gross bit rate including for example error-correction codes, and slightly lower maximum throughput) with the use of four spatial streams at a channel width of 40 MHz.802.11n standardized support for multiple-input multiple-output and frame aggregation, and security improvements, among other features.

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Bluetooth
i

Bluetooth

The device can be connected to another device via Bluetooth.

Yes

Audio

Chip
ROG SupremeFX
Audio channel
i

Audio channel

The descriptions of audio sound specifications distinguish between the number of discrete channels encoded in the original signal and the number of channels reproduced for playback.

8.1 Channel
Audio (3. 5 mm) connectors
i

Audio (3. 5 mm) connectors

Es sind 3.5mm Audioanschlüsse vorhanden. (Mindestens Audio Output).

1 x
Optical TOSLINK
i

Optical TOSLINK

S/PDIF (Sony/Philips Digital Interconnect Format) is a type of digital audio interconnect cable used in consumer audio equipment to output audio over reasonably short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.

More information...

1 x

Internal interfaces

USB 3.0 type A
i

USB 3.0 type A

The universal serial bus (USB) is a serial bus system for the connection of a computer to external devices. USB3.0 can reach up to 5 Gbit/s in Superspeed modus.

More information...

1 x
USB 2.0 type A
i

USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

More information...

1 x
Number of fan connector
i

Number of fan connector

Beschreibt wie viele Lüfterstecker auf dem Motherboard vorhanden sind.

More information...

6
Onboard power button
i

Onboard power button

Power-On Knopf auf dem Motherboard.

Yes
Reset button onboard
i

Reset button onboard

Reset Taste direkt auf dem Mainboard.

Yes
S/PDIF Header
i

S/PDIF Header

ony/Philips Digital Interface (S/PDIF) ist eine Schnittstellen-Spezifikation für die elektrische oder optische Übertragung digitaler Stereo- oder Mehrkanal-Audiosignale zwischen verschiedenen Geräten für die Anwendung im Unterhaltungselektronikbereich.

More information...

1 x
Temperature sensor connections
i

Temperature sensor connections

Anschlüsse auf dem Motherboard um zusätzliche externe Temperatursensoren anzuschliessen.

1 x

External interfaces

i

External interfaces

Beschreibt welche Schnittstellen das Gerät besitzt, die von aussen (das Gerät muss dafür nicht geöffnet werden) zugänglich sind.

USB 2.0 type A
i

USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

More information...

4 x
USB 3.0 type A
i

USB 3.0 type A

The universal serial bus (USB) is a serial bus system for the connection of a computer to external devices. USB3.0 can reach up to 5 Gbit/s in Superspeed modus.

More information...

4 x
USB 3.1
1 x
USB Typ-C
1 x

Power supply

i

Power supply

All power supply related details.

Power connectors
i

Power connectors

Beschreibt wie viele Stromanschlüsse das Gerät/Objekt hat/benötigt.

More information...

24-pin ATX
i

24-pin ATX

More information...

,
8-pin ATX 12V
i

8-pin ATX 12V

More information...

Delivery contents

i

Delivery contents

The scope of delivery means the included accessories.

S-ATA cable
3 x
Manual
i

Manual

A user guide or user's guide, also commonly known as a manual, is a technical communication document intended to give assistance to people using a particular system.[1] It is usually written by a technical writer, although user guides are written by programmers, product or project managers, or other technical staff, particularly in smaller companies.

User guides are most commonly associated with electronic goods, computer hardware and software.

More information...

Yes

Product dimensions

i

Product dimensions

Physical size of an object

Length
305 mm
Width
244 mm

Please click directly on the incorrect data to access the registration form.

Alternatively, you can register a generic error report (wrong picture, unsuitable accessories, etc.)

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Returns and warranty

Dead on arrival (DOA) 7 Days Bring-in
Warranty 36 month Bring-in
30-day right of return
i

30-day right of return

This product may be returned within 30 days after shipment or collection. A minimum of 10% will be deducted from opened products. Unfortunately, we cannot accept a product if it is damaged, incomplete or missing its original packaging.

Returns and warranty

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Warranty services

Warranty extension Bring-in

Warranty extension Bring-in

The warranty is extended at the same conditions as the manufacturer warranty.

to 5 years CHF 58.20

More information about warranty services

Availability

Mail delivery

 Expected delivery time from external warehouse: approx. 4–6 days
> 5 item(s) ready for shipment from external warehouse

Collection

All locations

 Expected delivery time: approx. 5–7 days
Currently > 5 piece(s) in stock at the supplier

If ordered immediately.
Information subject to change.

Matching accessories

Keyboards

ROG Claymore (USB, CH, Cable, MX-Red)
Sale
CHF 179.–instead of 229.–1
ASUS ROG Claymore (USB, CH, Cable, MX-Red)
1

Availability

Mail delivery

  • more than 10 piece(s)
    in our warehouse

PickMup

Collection

  • Basel: approx. 25.09.2017
  • Bern: tomorrow at 12:45
  • Dietikon: only 1 piece(s)
  • Geneva: approx. 25.09.2017
  • Kriens: approx. 25.09.2017
  • Lausanne: approx. 25.09.2017
  • St Gallen: approx. 25.09.2017
  • Winterthur: tomorrow at 12:45
  • Wohlen: today at 14:30
  • Zurich: today at 17:30

If ordered immediately.
Information subject to change.

View details

+1

Mice

ROG Spatha (Cable, Wireless)
Sale
CHF 149.–instead of 169.–1
ASUS ROG Spatha (Cable, Wireless)
9

Availability

Mail delivery

  • 6 piece(s)
    in our warehouse

PickMup

Collection

  • Basel: approx. 25.09.2017
  • Bern: tomorrow at 12:45
  • Dietikon: today at 14:30
  • Geneva: approx. 25.09.2017
  • Kriens: approx. 25.09.2017
  • Lausanne: approx. 25.09.2017
  • St Gallen: approx. 25.09.2017
  • Winterthur: tomorrow at 12:45
  • Wohlen: today at 14:30
  • Zurich: today at 17:30

If ordered immediately.
Information subject to change.

View details

Customer questions and answers

The 3 most helpful customer questions

User Noël K.

Guten Tag
Ich würde mir gerne diesen PC zusammenbauen: https://www.digitec.ch/de/ShopList/Show?
Sind die Teile alle kompatibel? Vorallem funktionieren der RAM 3200 auf 2133 wie es im Mainboard steht?

28.05.2017
4 answers
User j.elkuch
Accepted answer

Ja, passt alles. Eine Antistatikmatte ist nicht nötig, nimm einfach die Motherboardschachtel als Unterlage. Als Powersupply reicht alles über 450W, ich empfehle 750W (Habe einen PC mit genau den gleichen specs übertaktet mit 400W psu. (Verbrauch ist ca 330W unter vollast.) Bei deinen Komponenten schätze ich ca 400W. Mein i7-7700k läuft auf 4.8ghz bei 80-90° mit dem Gleichen X62 Kühler. Ich empfehle dir die Ryzen Prozessoren anzuschauen, habe den Ryzen 7 1700 auf 3.9ghz auf allen 8 Kernen auf 50° unter vollast. Die Performance bläst den i7-6900k aus dem wasser für nur 350.-

28.05.2017

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Customer ratings

Overall rating

6
Avg. 5.0 of 5 stars

The 3 most useful ratings

User nbfsh579
MAXIMUS IX FORMULA (LGA 1151, Intel Z270, ATX)

Empfehlenswert

Alle Asus Maximus IX haben 4x USB 3.0 und 4x USB 2.0 Anschlüsse auf der Rückseite. Von denen kann man nie genug haben. Die Verarbeitungs-Qualität ist hervorragend. Darum kann ich alle Mainboard dieser Serie empfehlen. Je nach Ausstattungs-Wunsch kann sich jeder das geeignete aussuchen.

i7 7700K Core Speed 4700 MHz (Multiplikator 47x) und Core Voltage 1.280

3 Stunden Prime95 v29.10, Temperaturhöchstwerte 98C
3Dmark Time Spy V1.0, 6131 CPU-Punkte, Temperaturhöchstwerte 80C
3Dmark Fire Strike V1.1, 15208 Physik Punkte, Temperaturhöchstwerte 76C
CPU-Z Stresstest, Temperaturhöchstwerte 73C

Die Tests sind bei geschlossenem Gehäuse gemacht worden.

System: Asus Maximus IX Formula, Intel i7-7700K, Zalman CNPS 9900 MAX, 32 GB G.Skill F4-3200C14Q-32GTZ, Gigabyte GTX 1070 XtremeGaming, be quiet! Dark Power Pro 11 (650W), 4x Samsung SSD 850 Pro, 1x WD Harddisk Black WD6001FZWX 6 TB, Lian-Li PC-10NA Kingmod (Midi Tower, Gedämmt).

Startvorgang des Systems beschleunigen:

Extreme Tweaker - DRAM Timing Control
- MRC Fast Boost [Enabled] Vorher unbedingt die Speichereinstellungen auf Stabilität testen, da das Speicherretraining damit deaktiviert wird!
- MCH Full Check [Disabled]

Boot
- Option ROM Messages [Disabled]
- Fast Boot [Enabled]
- POST delay time [0]
- Boot Logo [Disabled]

Boot - Boot\CSM (Compatibility Support Module)
- CSM [Disabled]
more

+5+4

+
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+
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-

18.04.2017
10 Comments
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User Sulejman
MAXIMUS IX FORMULA (LGA 1151, Intel Z270, ATX)

Board top

Produkt ist an und für sich top, ich versuche hier nur die negativen Aspekte hervorzuheben. Wer nicht eine individuelle Wasserkühlung macht kann gleich ein leichteres Modell nehmen, diese sind genau so gut. Für den Preis würde man meinen, dass eine individuellere Anleitung vorliegt und nicht eine die alle Asus Boards beschreibt (aber das ist bei allen so).more


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27.03.2017
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User xerasian
MAXIMUS IX FORMULA (LGA 1151, Intel Z270, ATX)

Topleistung - aber auch zu Top-preisen.

Es besitzt eine grosse Anzahl von Features die gerade Enthusiasten und Overclocker begeistern wird.


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23.05.2017
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ASUS MAXIMUS IX FORMULA (LGA 1151, Intel Z270, ATX) ASUS MAXIMUS IX FORMULA (LGA 1151, Intel Z270, ATX)