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The AMD Ryzen 7 8700F Tray is a powerful processor optimized for demanding applications and multitasking. With a base clock speed of 4.1 GHz and a maximum turbo frequency of up to 5 GHz, this processor delivers impressive performance for gaming, content creation, and other compute-intensive tasks. The Ryzen 7 8700F belongs to the 7th generation of Ryzen processors and features 8 cores and 16 threads, allowing for efficient processing of multiple tasks simultaneously. Support for DDR5 RAM and a dual-channel memory architecture provide high bandwidth and fast data transfers. With a maximum thermal design power (TDP) of 65 watts, the processor is energy-efficient and suitable for both desktop and compact systems. The advanced 4-nanometer lithography enhances energy efficiency and overall performance, while technologies like AMD Precision Boost dynamically adjust performance for optimal results.

- 8 cores and 16 threads for efficient multitasking
- Maximum turbo frequency of 5 GHz for high performance
- Support for DDR5 RAM to improve memory bandwidth
- Energy-efficient 65-watt TDP for lower power consumption
- Dual-channel memory architecture for faster data transfers.

Actual product image AMD DUPLIKAT Ryzen 7 8700F Tray (AM5, 4.10 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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