Name: Ryzen 5 9600X Tray 36 units
Brand: AMD
SKU: 47493513
Price: 259 CHF
Availability: InStock

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The AMD Ryzen 5 9600X is a powerful processor optimized for demanding applications and multitasking. With an advanced 4nm lithography and a base frequency of 3.9 GHz that can be boosted up to 5.4 GHz in turbo mode, this processor delivers impressive performance for modern computing tasks. It belongs to the Ryzen 5 family and features an AM5 socket, making it future-proof for upcoming technologies. The processor supports up to 192 GB of DDR5 RAM and enables efficient data processing through its dual memory channels. Additionally, the Ryzen 5 9600X comes with integrated graphics capabilities with a base frequency of 2200 MHz, making it a versatile choice for various applications.

- Maximum turbo clock speed of 5.4 GHz for high performance
- Supports up to 192 GB of DDR5 RAM for extensive memory requirements
- Six cores and twelve threads for efficient multitasking
- Integrated AMD Radeon graphics for basic visual applications
- PCI Express 5.0 support for faster data transfers.

Actual product image AMD Ryzen 5 9600X Tray 36 units (AM5, 3.90 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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