Name: Ryzen 5 8400F
Brand: AMD
SKU: 45823496
Price: 169 CHF
Availability: InStock

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The AMD Ryzen 5 8400F is a powerful processor designed for desktop applications. With a base clock speed of 4.2 GHz and a maximum turbo clock speed of 4.7 GHz, this processor delivers impressive performance for multitasking and demanding applications. It features 6 cores and 12 threads, allowing for efficient processing of multiple tasks simultaneously. The processor is equipped with a 16 MB L3 cache, which enhances data processing speed and optimizes overall performance. The Ryzen 5 8400F utilizes advanced 4nm lithography and is compatible with the AM5 socket, making it future-proof for upcoming technologies. It is supported by DDR5 SDRAM, providing high bandwidth and improved energy efficiency. This processor is ideal for users seeking a combination of performance and efficiency, whether for gaming, creative applications, or general productivity.

- Maximum turbo clock speed of 4.7 GHz
- Supports DDR5 SDRAM with memory speeds up to 5200 MHz
- Dual-channel memory architecture for enhanced performance
- Compatible with modern operating systems like Windows 10/11 and Ubuntu
- Includes AMD Precision Boost for optimized performance.

Actual product image AMD Ryzen 5 8400F (AM5, 4.20 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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