Name: Fx-6300
Brand: AMD
SKU: 402924
Rating: 4.75 (12 reviews)

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The AMD FX-6300 processor is a powerful eight-core desktop processor optimized for demanding applications and multitasking. With a base clock speed of 3.5 GHz and the ability to turbo boost up to 4.1 GHz, this processor delivers impressive computing power. The innovative "Bulldozer" architecture allows performance to be dynamically adjusted to meet the requirements of specific applications without increasing power consumption. The FX-6300 is ideal for users who want to engage in intensive tasks such as video editing, 3D modeling, or gaming. Additionally, the processor is unlocked for overclocking, enabling personalized performance tuning. With an excellent price-performance ratio, the AMD FX-6300 is an attractive choice for anyone seeking maximum performance in their desktop PC.

- First native eight-core desktop processor in the industry
- Efficient overclocking management with AMD OverDrive™ technology
- Dynamic performance adjustment through AMD Turbo Core technology
- Optimized for megatasking and intensive applications
- Supports modern technologies such as AMD Virtualization and AVX.

Actual product image AMD Fx-6300 (AM3+, 3.50 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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