Name: EPYC 9375F - 3.85 GHz - 32 cores - 6
Brand: AMD
SKU: 53031009
Price: 3276.9 CHF
Availability: InStock

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The AMD EPYC 9375F is a powerful processor specifically designed for use in server environments. With a base clock frequency of 3.85 GHz and the ability to reach up to 4.8 GHz in turbo mode, this processor delivers impressive performance for demanding applications. It features 32 cores and supports 64 threads, enabling high parallel processing and enhancing efficiency in executing multithreaded applications. The EPYC 9375F is equipped with a generous 256 MB L3 cache, further optimizing data processing speed. The processor uses the SP5 socket and supports the latest DDR5 memory, allowing for a high memory bandwidth of up to 576 GB/s. These features make the EPYC 9375F an ideal choice for companies that require powerful and scalable server solutions.

- Dodeca-channel memory architecture for improved data processing
- Maximum Thermal Design Power (TDP) of 320 watts
- Support for PCI Express 5 for faster data transfers
- Optimized for virtualization and cloud computing applications
- 64-bit processor architecture for enhanced software compatibility.

Actual product image AMD EPYC 9375F - 3.85 GHz - 32 cores - 6 (SP5, 3.85 GHz, 32 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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