Name: Epyc 7301
Brand: AMD
SKU: 12279465
Price: 109 CHF
Availability: InStock

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The Epyc 7301 processor is a powerful solution designed for demanding computing requirements. With a balanced architecture, this processor offers a combination of high computing performance, extensive memory and I/O capabilities, as well as advanced security features. It is ideal for use in mission-critical applications that require reliable and efficient processing. The Epyc 7301 supports a wide range of applications, enabling businesses to optimize their workloads and enhance performance. With a maximum Thermal Design Power (TDP) of 170 watts and a 64-bit architecture, this processor is both energy-efficient and powerful.

- 16 processor cores with 32 threads for parallel processing
- Maximum turbo clock frequency of 2.7 GHz for additional performance
- Octa-channel memory architecture for high bandwidth
- 64 MB L3 cache to improve data processing speed
- Designed for mission-critical applications with a focus on security and efficiency.

Actual product image AMD Epyc 7301 (SP3, 2.20 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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