Name: CPU.I5.4430.3.0G.6M.1600.QUAD
Brand: Acer
SKU: 18092076
Price: 369 CHF
Availability: InStock

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Acer

The Acer CPU I5-4430 is a powerful processor from the 4th generation of the Intel Core i5 family, suitable for a variety of applications. With a base clock frequency of 3.0 GHz and a maximum turbo frequency of 3.2 GHz, this quad-core processor delivers efficient performance for multitasking and compute-intensive tasks. The processor is equipped with 4 threads, allowing for improved handling of parallel tasks. The integrated HD Graphics 4600 provides appealing graphics rendering, while support for up to 32 GB of DDR3 RAM and dual-channel memory channels offers high flexibility in system configuration. With a maximum thermal design power (TDP) of 84 watts, the processor is energy-efficient and suitable for both desktop and compact systems. Support for virtualization technologies enables the simultaneous running of multiple operating systems, making it an ideal choice for developers and IT professionals.

- Processor socket: LGA 1150
- Max. turbo frequency: 3.2 GHz
- Integrated HD Graphics 4600
- Support for virtualization technologies (VT-x, VT-d)
- Max. connectable monitors: 3.

Actual product image Acer CPU.I5.4430.3.0G.6M.1600.QUAD (LGA 1150, 3 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Number of threads

PCI express version (max.)

Item number

CPU.I5.4430.3.0G.6M.1600.QUAD

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