Loctite Output 315 thermal conduct adhesive kit

Type: Thermal conductive adhesive
Product material: Acrylic
Container type: Bottle, syringe
Packaging unit: 18 ml, 25 ml
Thermal conductivity: 0.815 W/mK
Curing time: 72 h
Operating temperature max.: +150°C
Operating temperature min.: -55°C
Operating temperature range: -55 to +150 °C

Thermally conductive adhesive SMT Output™ 315 is designed for attaching transistors to heat sinks and heat sinks to PCBs. The kit includes a 25 ml syringe and an 18 ml activator. It features high thermal conductivity for excellent heat dissipation, controlled force for easy disassembly, and a fast room-temperature cure. The self-leveling capability provides a continuous 0.15 mm (0.006 in.) gap to ensure controlled electrical isolation between connected components. The coefficient of thermal expansion is 1.1 x 10^-4/°C, with an outgassing of 4.5%. The temperature range is -55 °C to +150 °C, with a cure time of 72 hours and a tensile strength of 7 N/mm² (1000 psi). Typical applications include fastening electronic components to heat sinks and fastening heat sinks to printed circuit boards.