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Lenovo x3100 M5 (Intel Xeon E3-1220 v3, 8GB, 1000GB, 3.5") Actual product image
CHF 1725.–

Lenovo x3100 M5 (Intel Xeon E3-1220 v3, 8GB, 1000GB, 3.5")

Specifications

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General information

Manufacturer Lenovo
Product type Servers
Item number5710245
Manufacturer no.5457K2G

Hardware form factor

Number of rack units
4 U
Design
Tower

Processor

Processor type
Intel Xeon E3-1220 v3
Number of processors
1 x
Processor clock frequency
3.10 GHz
Number of threads
4
Number of processor cores
i

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

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4 (Quad core)
i

4 (Quad core)

The processor has four cores.

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Number of processors socket
1 x
Max. turbo clock rate
3.50 GHz
Max. TDP
i

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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80 W
L3 Cache
i

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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8 MB
Processor family
Xeon E3

Motherboard properties

CPU socket
i

CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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LGA 1150
i

LGA 1150

LGA 1150, also called Socket H3, is an Intel microprocessor compatible socket which supports the future Intel Haswell and Broadwell microprocessors.

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Memory

Memory type
DDR3-RAM
Memory Slots max
4
Storage capacity 1 (RAM)
8 GB
RAM total
8 GB
Max. RAM
32 GB
RAM speed
1600 MHz
RAM error correction
ECC
RAM buffer
i

RAM buffer

In addition to bandwidth and capacity variants, modules can
1. Optionally implement ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC in their designation.
2. Be "registered", which improves signal integrity (and hence potentially clock speed and physical slot capacity) by electrically buffering the signals at a cost of an extra clock of increased latency. Those modules are identified by an additional R in their designation, whereas non-registered (a.k.a. "unbuffered") RAM may be identified by an additional U in the designation.
3. Be Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion.

unbuffered

Hard drives

Number of hard disks max
4
Storage capacity
1000 GB
Form factor
3.5"
Computer storage interface
SATA III

External interfaces

USB 3.0 type A
2 x
USB 2.0 type A
i

USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

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4 x

Internal interfaces

USB 2.0 type A
i

USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

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1 x

Network

Ethernet controller
BCM5717
Ethernet controller brand
Broadcom
i

Broadcom

Broadcom Corporation is a fabless semiconductor company in the wireless and broadband communication business.

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RJ45/LAN port
i

RJ45/LAN port

Network connection allows connection to an internal or external network.

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2 x
Max. port speed
i

Max. port speed

Describes the maximum data transfer rate. Is not necessarily supported by all ports.

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1000 Mbit/s
i

1000 Mbit/s

In computer networking, Gigabit Ethernet (GbE or 1 GigE) is a term describing various technologies for transmitting Ethernet frames at a rate of a gigabit per second (1,000,000,000 bits per second).

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Optical drive properties

Optical drive type
DVD writer
i

DVD writer

The drive can read and write DVD and CD disks.

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Operating system

Operating system
No operating system

Mains supply properties

Number of power supply units
1 x
Power
300 W
Max. Number of power supply units
1

Product dimensions

Length
480 mm
Width
180 mm
Height
360 mm
Weight
14 kg

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Returns and warranty

Dead on arrival (DOA) 6 Days Bring-in
Warranty 24 month Bring-in
30-day right of return
i

30-day right of return

Unfortunately, we cannot accept a product if it is damaged, incomplete or missing its original packaging.

Returns and warranty

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Services

Delivery to the place of use and installation of your server

Delivery to the place of use and installation of your rack server or installation of your tower server

Take-back and disposal of your old server

Take-back and disposal of your old server

Availability

Mail delivery/Collection

Product is not ready for sale or temporarily not available. No delivery date known.
Not in stock

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Information subject to change.

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Lenovo x3100 M5 (Intel Xeon E3-1220 v3, 8GB, 1000GB, 3.5") Lenovo x3100 M5 (Intel Xeon E3-1220 v3, 8GB, 1000GB, 3.5")