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HPE ProLiant ML150 Gen9 (Intel Xeon E5-2609 v3, 8GB, 3.5") Not categorized

HPE ProLiant ML150 Gen9 (Intel Xeon E5-2609 v3, 8GB, 3.5")

Specifications

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General information

Manufacturer HPE
Product type Servers
Item number3481810
Manufacturer no.776275-421

Hardware form factor

Number of rack units
5 U
Design
Tower

Processor

Processor type
Intel Xeon E5-2609 v3
Number of processors
1 x
Processor clock frequency
1.90 GHz
Number of threads
6
Number of processor cores
i

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

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6
i

6

The processor has six cores.

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Number of processors socket
2 x
Max. TDP
i

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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85 W
L3 Cache
i

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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15 MB
Processor family
Xeon E5

Motherboard properties

CPU socket
i

CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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LGA 2011-v3

Memory

Memory type
DDR4-RAM
Memory Slots max
16
Storage capacity 1 (RAM)
8 GB
RAM total
8 GB
Max. RAM
256 GB
RAM speed
1600 MHz
RAM error correction
ECC
RAM buffer
i

RAM buffer

In addition to bandwidth and capacity variants, modules can
1. Optionally implement ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC in their designation.
2. Be "registered", which improves signal integrity (and hence potentially clock speed and physical slot capacity) by electrically buffering the signals at a cost of an extra clock of increased latency. Those modules are identified by an additional R in their designation, whereas non-registered (a.k.a. "unbuffered") RAM may be identified by an additional U in the designation.
3. Be Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion.

Registered

Data storage controller

Possible raid configuration
0
i

0

(block-level striping without parity or mirroring) has no (or zero) redundancy. It provides improved performance and additional storage but no fault tolerance.

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,
1
i

1

(mirroring without parity or striping), data are written identically to two drives, thereby producing a "mirrored set"; the read request is serviced by either of the two drives containing the requested data, whichever one involves least seek time plus rotational latency.

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,
5
i

5

(block-level striping with distributed parity) distributes parity along with the data and requires all drives but one to be present to operate; the array is not destroyed by a single drive failure.

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,
10
i

10

A RAID 10 group is a RAID 0 over several RAID 1, combining the characteristics of both RAIDs: security and increased read/write speed.
A RAID 10 network requires at least four hard disks.

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Mass storage controller type
SATA-600
Data storage controller
HP Smart Array B140i

Hard drives

Number of hard disks max
4
Form factor
3.5"
Computer storage interface
SATA III
hot plugging
Yes

Expansion slots

PCI express version (max.)
4
PCI Express 3.0 x16
1 x
PCI Express x8
i

PCI Express x8

PCI Express, officially abbreviated as PCI-E or PCIe, is a computer expansion card interface format introduced by Intel in 2004. PCI Express was designed to replace the general-purpose PCI expansion bus, the high-end PCI-X bus and the AGP graphics card interface. Unlike previous PC expansion interfaces, rather than being a bus it is structured around point-to-point serial links called lanes.

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3 x

External interfaces

USB 3.0 type A
4 x
USB 2.0 type A
i

USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

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2 x

Internal interfaces

USB 3.0 type A
1 x
USB 2.0 type A
i

USB 2.0 type A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

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1 x

Network

Ethernet controller
331i
Ethernet controller brand
HP
RJ45/LAN port
i

RJ45/LAN port

Network connection allows connection to an internal or external network.

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2 x
Max. port speed
i

Max. port speed

Describes the maximum data transfer rate. Is not necessarily supported by all ports.

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1000 Mbit/s
i

1000 Mbit/s

In computer networking, Gigabit Ethernet (GbE or 1 GigE) is a term describing various technologies for transmitting Ethernet frames at a rate of a gigabit per second (1,000,000,000 bits per second).

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Video connections

VGA
i

VGA

A VGA connector as it is commonly known (other names include RGB connector, D-sub 15, mini sub D15 and mini D15) is a three-row 15 pin DE-15. There are four versions: original and DDC2 pinouts, the far older and less flexible DE-9 connector, and a Mini-VGA used for laptops.
The common 15-pin VGA connector found on most video cards, computer monitors, and other devices, is almost universally called "HD-15". HD stands for "high-density", which distinguishes it from connectors having the same form factor but only 2 rows of pins. However, this connector is often incorrectly referred to as a DB-15 or HDB-15.[citation needed]
"VGA connectors" and their associated cabling are almost always used solely to carry analog component RGBHV (red - green - blue - horizontal sync - vertical sync) video signals along with DDC2 digital clock and data.
Where size is a constraint (such as laptops) a mini-VGA port can sometimes be found in place of the full-sized VGA connector.

1 x

Optical drive properties

Optical drive type
No drive

Operating system

Operating system
No operating system

Mains supply properties

Number of power supply units
1 x
Power
550 W

Product dimensions

Length
620 mm
Width
200 mm
Height
432.60 mm
Weight
16.90 kg

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Returns and warranty

Dead on arrival (DOA) 30 Days Bring-in
Warranty 36 month Bring-in
Warranty 12 month On-Site
30-day right of return
i

30-day right of return

Unfortunately, we cannot accept a product if it is damaged, incomplete or missing its original packaging.

Returns and warranty

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Services

Delivery to the place of use and installation of your server

Delivery to the place of use and installation of your rack server or installation of your tower server

Take-back and disposal of your old server

Take-back and disposal of your old server

Availability

Mail delivery/Collection

Currently unavailable. Delivery date unknown.
We do not have any information regarding the delivery date. It will be shown as soon as it's known.

Information subject to change.

Matching accessories

Model-specific memory

726717-B21 (1x, 4GB, DDR4-RAM, Registered, ECC)
CHF 159.–
HPE 726717-B21 (1x, 4GB, DDR4-RAM, Registered, ECC)

Availability

  • approx. 8 – 10 days
    Currently 1 piece(s) in stock at the supplier

If ordered immediately.
Information subject to change.

View details

+1

Server accessories

No image

CHF 52.–
HPE 786710-B21 Smart Storage Battery Holder Kit für ML150 G9

Availability

Mail delivery

  • approx. 6 – 8 days
    1 item(s) ready for shipment from external warehouse

Collection

  • All locations: approx. 8 – 10 days
    Currently 1 piece(s) in stock at the supplier

If ordered immediately.
Information subject to change.

View details

+14

Server warranty extensions (ESD)

+1

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HPE ProLiant ML150 Gen9 (Intel Xeon E5-2609 v3, 8GB, 3.5") HPE ProLiant ML150 Gen9 (Intel Xeon E5-2609 v3, 8GB, 3.5")