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Fractal Kelvin S36 Actual product image

Fractal Kelvin S36

Specifications

Key specifications

SocketAM3, LGA 775, AM2, AM2+, LGA 1366, FM1, LGA 1156, LGA 1155, LGA 2011, AM3+, FM2, LGA 1150, FM2+, LGA 2011-v3, LGA 1151
Rotations speed range500 - 2000 RPM

General information

Manufacturer Fractal
Product type CPU coolers
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CPU coolers

Computer cooling is required to remove the waste heat produced by computer components, to keep components within their safe operating temperature limits. Various cooling methods help to improve processor performance or reduce the noise of cooling fans.

More information...

Item number5990209
Manufacturer no.FD-WCU-KELVIN-S36-BK
External links Manufacturer's site (de)

Product dimensions

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Product dimensions

Physical size of an object

Length (without fan)
6.90 cm
Width (without fan)
6.90 cm
Height (without fan)
4 cm

Cooler properties

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Cooler properties

A cooler is used for heat dissipation, which usually results in a reduction in temperature. A heat sink absorbs the heat, the cooling medium (usually air or water) ensures that the heat is dissipated.

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Fan type
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Fan type

Describes the type of fan

Watercooled
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Watercooled

Water cooling is a method of heat removal from components and industrial equipment. As opposed to air cooling, water is used as the heat conductor.

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CPU socket
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CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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AM3
,
LGA 775
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AM2
,
AM2+
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LGA 1366
,
FM1
,
LGA 1156
,
LGA 1155
,
LGA 2011
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LGA 2011

LGA 2011, also called Socket R, is a CPU socket by Intel. It replaces Intel's LGA 1366 (Socket B) and LGA 1567 in the performance and high-end desktop and server platforms. The socket has 2,011 protruding pins which touch contact points on the underside of the processor.

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,
AM3+
,
FM2
,
LGA 1150
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LGA 1150

LGA 1150, also called Socket H3, is an Intel microprocessor compatible socket which supports the future Intel Haswell and Broadwell microprocessors.

More information...

,
FM2+
,
LGA 2011-v3
,
LGA 1151
Cooler mounting
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Cooler mounting

Specifies how the cooler is attached.

backplane
Supported fan sizes
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Supported fan sizes

Specifies which fan sizes are supported by the product.

120mm

Heat sink properties

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Heat sink properties

In electronic systems, a heat sink is a passive heat exchanger component that cools a device by dissipating heat into the surrounding air.

More information...

Length
397 mm
Width
124 mm
Height
30 mm

Power supply

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Power supply

All power supply related details.

Voltage
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Voltage

The voltage between two points is a short name for the electrical force that would drive an electric current between those points. Specifically, voltage is equal to energy per unit charge. In the case of static electric fields, the voltage between two points is equal to the electrical potential difference between those points. In the more general case with electric and magnetic fields that vary with time, the terms are no longer synonymous.

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12 V

Fan dimensions

Diameter
120 mm
Length
120 mm
Width
120 mm
Height
25 mm

Fan Properties

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Fan Properties

A computer fan is any fan inside, or attached to, a computer case used for cooling purposes, and may refer to fans that draw cooler air into the case from the outside, expel warm air from inside, or move air across a heatsink to cool a particular component. The use of fans to cool a computer is an example of active cooling.

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Number of fans
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Number of fans

Only one of the specified sizes is possible at a time.

More information...

3 x
Maximum mountable fan
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Maximum mountable fan

Indicates the total number of fans that can be installed.

3
Rotations speed range
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Rotations speed range

Min. to Max. Fan speed

500 - 2000 RPM
Air flow
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Air flow

The volumetric flow rate in fluid dynamics and hydrometry, (also known as volume flow rate or rate of fluid flow) is the volume of fluid which passes through a given surface per unit time (for example cubic meters per second [m3/s] in SI units, or cubic feet per second [cu ft/s]). It is usually represented by the symbol Q.

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148.83 m3/h
Static pressure
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Static pressure

The hydrostatic pressure exerts a force on each surface in contact with the fluid that is proportional to the size of the surface - the larger the surface, the greater the force acting on it. This form of pressure is therefore a special form of elastic stress that is characteristic of ideal liquids and gases.

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0.23 Pa
Noise level (max.)
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Noise level (max.)

The sound that is called noise that a device emits when it is active.

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32.20 dB

Connections

4pin PWM
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4pin PWM

4pin connector can connect to 3pin connectors.

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3 x

Properties

Delivery contents
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Delivery contents

The scope of delivery means the included accessories.

Manual
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Manual

A user guide or user's guide, also commonly known as a manual, is a technical communication document intended to give assistance to people using a particular system.[1] It is usually written by a technical writer, although user guides are written by programmers, product or project managers, or other technical staff, particularly in smaller companies.

User guides are most commonly associated with electronic goods, computer hardware and software.

More information...

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Thermal grease
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Thermal grease

Thermal grease (also called thermal gel, thermal compound, thermal paste, heat paste, heat sink paste, heat transfer compound, heat transfer paste (HTP) or heat sink compound) is a fluid substance, originally with properties akin to grease, which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components; the compound has far greater thermal conductivity than air (but far less than metal). In electronics, it is often used to aid a component's thermal dissipation via a heat sink.

More information...

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Mounting material
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Mounting material

Various materials such as screws, that is used for mounting.

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Y-Split Cable
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Y-Split Cable

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Returns and warranty

Dead on arrival (DOA) 10 Days Bring-in
Warranty 24 month Bring-in
30-day right of return
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30-day right of return

Unfortunately, we cannot accept a product if it is damaged, incomplete or missing its original packaging.

Returns and warranty

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Warranty services

Warranty extension

Warranty extension

The warranty is extended at the same conditions as the manufacturer warranty.

to 3 years CHF 16.10
to 5 years CHF 21.50

More information about warranty services

Availability

Mail delivery/Collection

Currently unavailable. Delivery date unknown.
We do not have any information regarding the delivery date. It will be shown as soon as it's known.

Information subject to change.

Customer questions and answers

The 3 most helpful customer questions

User daYMAN007

Beinhalted dieses Paket mitlerweile schon ein AM4 Kit? Oder muss man das immer noch vom Hersteller anfordern?

02.09.2017
1 answer
User meierhoferit
Accepted answer

Hallo. So wie es aussieht ist auch in der neuesten Produktbeschreibung bei fractal das AM4 nicht mit dabei:
Supported sockets
• Intel: 775,1150,1155,1156,1366,2011,2011-v3
• AMD: AM2,AM2+,AM3,AM3+,FM1,FM2,FM2+
somit muss man es leider immer noch anfordern.

03.09.2017

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