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CHF 108.–

Fractal Kelvin S24

Art-Nr 5868654
 approx. 3-5 days > 5 item(s) ready for shipment from external warehouse

Availability

Mail delivery

  • approx. 3-5 days
    > 5 item(s) ready for shipment from external warehouse

Collection

  • All locations: approx. 4-6 days
    Currently > 5 piece(s) in stock at the supplier

If ordered immediately.
Information subject to change.

View details

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Specifications

Key specifications

SocketFM2+, LGA 1151, LGA 2011-v3, LGA 1150, FM2, LGA 1366, LGA 2011, AM3+, FM1, LGA 1156, LGA 1155, AM3, LGA 775, AM2, AM2+
Rotations speed range500 - 2000 RPM

General information

Manufacturer Fractal
Product type CPU coolers
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CPU coolers

Computer cooling is required to remove the waste heat produced by computer components, to keep components within their safe operating temperature limits. Various cooling methods help to improve processor performance or reduce the noise of cooling fans.

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Item number5868654
Manufacturer no.FD-WCU-KELVIN-S24-BK
Sales rank in Product type CPU coolers72 of 161
External links Manufacturer's site (en)

Product dimensions

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Product dimensions

Physical size of an object

Length (without fan)
6.90 cm
Width (without fan)
6.90 cm
Höhe (ohne Lüfter)
4 cm

Cooler properties

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Cooler properties

Ein Kühler wird zur Wärmeabfuhr eingesetzt, die meist eine Temperaturverringerung mit sich bringt. Ein Kühlkörper nimmt die Wärme auf, das Kühlmedium (meist Luft oder Wasser) sorgt für den Abtransport der Wärme.

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Fan type
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Fan type

Describes the type of fan

Watercooled
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Watercooled

Water cooling is a method of heat removal from components and industrial equipment. As opposed to air cooling, water is used as the heat conductor.

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CPU socket
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CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

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FM2+
,
LGA 1151
,
LGA 2011-v3
,
LGA 1150
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LGA 1150

LGA 1150, also called Socket H3, is an Intel microprocessor compatible socket which supports the future Intel Haswell and Broadwell microprocessors.

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FM2
,
LGA 1366
,
LGA 2011
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LGA 2011

LGA 2011, also called Socket R, is a CPU socket by Intel. It replaces Intel's LGA 1366 (Socket B) and LGA 1567 in the performance and high-end desktop and server platforms. The socket has 2,011 protruding pins which touch contact points on the underside of the processor.

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,
AM3+
,
FM1
,
LGA 1156
,
LGA 1155
,
AM3
,
LGA 775
,
AM2
,
AM2+
Cooler mounting
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Cooler mounting

Specifies how the cooler is attached.

Backplane
Supported fan sizes
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Supported fan sizes

Specifies which fan sizes are supported by the product.

120mm

Heat sink properties

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Heat sink properties

In electronic systems, a heat sink is a passive heat exchanger component that cools a device by dissipating heat into the surrounding air.

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Materials radiator core
Copper
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Copper

Copper is a chemical element with the symbol Cu (from Latin: cuprum) and atomic number 29. It is a ductile metal with very high thermal and electrical conductivity. Pure copper is soft and malleable; a freshly exposed surface has a reddish-orange color. It is used as a conductor of heat and electricity, a building material, and a constituent of various metal alloys.

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Hose length
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Hose length

Länge des Schlauches

320 mm
Length
275 mm
Width
124 mm
Height
30 mm

Fan dimensions

Length
120 mm
Width
120 mm
Height
30 mm

Fan Properties

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Fan Properties

A computer fan is any fan inside, or attached to, a computer case used for cooling purposes, and may refer to fans that draw cooler air into the case from the outside, expel warm air from inside, or move air across a heatsink to cool a particular component. The use of fans to cool a computer is an example of active cooling.

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Number of fans
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Number of fans

Es ist jeweils nur eine der angegeben Grössen möglich.

More information...

2 x
Maximum mountable fan
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Maximum mountable fan

Gibt an, wie viele Lüfter insgesamt montiert werden können.

2
Rotations speed range
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Rotations speed range

Min. bis Max. Drehzahl des Lüfters

500 - 2000 RPM
Air flow
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Air flow

The volumetric flow rate in fluid dynamics and hydrometry, (also known as volume flow rate or rate of fluid flow) is the volume of fluid which passes through a given surface per unit time (for example cubic meters per second [m3/s] in SI units, or cubic feet per second [cu ft/s]). It is usually represented by the symbol Q.

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148.83 m3/h
Static pressure
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Static pressure

Der hydrostatische Druck übt auf jede Fläche, die mit dem Fluid in Verbindung steht, eine Kraft aus, die zur Größe der Fläche proportional wirkt – je größer die Fläche, desto größer wird also die darauf wirkende Kraft. Diese Form des Drucks ist somit eine spezielle Form der elastischen Spannungen, die idealen Flüssigkeiten und Gasen eigen ist.

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0.23 Pa
Noise level (max.)
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Noise level (max.)

The sound that is called noise that a device emits when it is active.

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32.20 dB

Connections

4pin PWM
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4pin PWM

4pin connector can connect to 3pin connectors.

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1 x

Properties

Delivery contents
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Delivery contents

The scope of delivery means the included accessories.

Manual
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Manual

A user guide or user's guide, also commonly known as a manual, is a technical communication document intended to give assistance to people using a particular system.[1] It is usually written by a technical writer, although user guides are written by programmers, product or project managers, or other technical staff, particularly in smaller companies.

User guides are most commonly associated with electronic goods, computer hardware and software.

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Thermal grease
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Thermal grease

Thermal grease (also called thermal gel, thermal compound, thermal paste, heat paste, heat sink paste, heat transfer compound, heat transfer paste (HTP) or heat sink compound) is a fluid substance, originally with properties akin to grease, which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components; the compound has far greater thermal conductivity than air (but far less than metal). In electronics, it is often used to aid a component's thermal dissipation via a heat sink.

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,
Mounting material
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Mounting material

Various materials such as screws, that is used for mounting.


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Warranty & right to return

Dead on arrival (DOA) 10 Days Bring-in

Warranty 24 month Bring-in

Limited right of return

Warranty and return

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Warranty extension

Warranty extension Bring-in

Warranty extension Bring-in

The warranty is extended at the same conditions as the manufacturer warranty.

to 3 years CHF 35.90
to 5 years CHF 40.80

More information about warranty extensions

Availability

Mail delivery

Mail delivery

 Expected delivery time from external warehouse: approx. 3-5 days
> 5 item(s) ready for shipment from external warehouse

Collection

All locations

 Expected delivery time: approx. 4-6 days
Currently > 5 piece(s) in stock at the supplier

If ordered immediately.
Information subject to change.

Customer questions and answersShow all questions

The 1 most helpful customer questions


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Fractal Kelvin S24 Fractal Kelvin S24