You're not connected to the Internet.
CHF 386.–

EVGA X99 FTW (LGA 2011-v3, Intel X99, E-ATX)

Art-Nr 5898420
 approx. 4-6 days

Availability

Mail delivery

  • approx. 4-6 days

Collection

  • Basel: approx. 3-5 days
  • Bern: approx. 3-5 days
  • Dietikon: approx. 3-5 days
  • Kriens: approx. 3-5 days
  • Lausanne: approx. 3-5 days
  • St Gallen: approx. 3-5 days
  • Winterthur: approx. 3-5 days
  • Wohlen: approx. 1-3 days
  • Zurich: approx. 3-5 days

If ordered immediately.
Information subject to change.

View details

No ratings have been submitted yet for this product.

Rate this product

Specifications

Key specifications

Multi-GPU technologyNVIDIA SLI

General information

Manufacturer EVGA
Product type Motherboards
i

Motherboards

In personal computers, a motherboard is the central printed circuit board (PCB) in many modern computers and holds many of the crucial components of the system, providing connectors for other peripherals. The motherboard is sometimes alternatively known as the mainboard, system board, or, on Apple computers, the logic board. It is also sometimes casually shortened to mobo.

More information...

Item number5898420
Manufacturer no.150-HE-E997-KR
External links Manufacturer's site (de)
May include power adapter Yes
i

This product may require a power adapter. If this is the case, a suitable adapter is included in the delivery.

Motherboard properties

Form factor
i

Form factor

In der Computertechnik ist der Formfaktor eine Angabe über Größe und Befestigungsmöglichkeiten eines Bauteils, das in einem Computer Verwendung findet. Durch diese Standardisierung können verschiedene Komponenten einfach zusammengefügt und ausgetauscht werden.

More information...

E-ATX
CPU socket
i

CPU socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

More information...

LGA 2011-v3
Chipset
i

Chipset

Der Chipsatz unterstützt den Prozessor bei seiner Aufgabe.

More information...

Intel X99
UEFI BIOS
i

UEFI BIOS

The Unified Extensible Firmware Interface (UEFI) is a specification that defines a software interface between an operating system and platform firmware. UEFI is meant as a replacement for the Basic Input/Output System (BIOS) firmware interface, present in all IBM PC-compatible personal computers. In practice, most UEFI images have legacy support for BIOS services. UEFI can be used to allow remote diagnostics and repair of computers, even without another operating system.

More information...

Yes

Processor compatibility

Processor family
i

Processor family

The family the processor belongs to.

Core i7 6th Gen

Memory

i

Memory

Computer data storage, often called storage or memory, is a technology consisting of computer components and recording media used to retain digital data. It is a core function and fundamental component of computers.

More information...

Number of memory modules
i

Number of memory modules

Ein Speichermodul oder Speicherriegel ist eine kleine Leiterplatte, auf der mehrere Speicherbausteine (Dynamisches RAM in Form von integrierten Schaltkreisen) aufgelötet sind. Speichermodule bilden oder erweitern den Arbeitsspeicher elektronischer Geräte wie Computer oder Drucker und werden dort in speziell dafür vorgesehene Steckplätze gesteckt.

More information...

8 x
Max. memory
i

Max. memory

Ein Datenspeicher oder Speichermedium dient zur Speicherung von Daten beziehungsweise Informationen. Der Begriff Speichermedium wird auch als Synonym für einen konkreten Datenträger verwendet.

More information...

128 GB
Memory chip
i

Memory chip

Random-access memory is a form of computer data storage. A random-access device allows stored data to be accessed directly in any random order. In contrast, other data storage media such as hard disks, CDs, DVDs and magnetic tape, as well as early primary memory types such as drum memory, read and write data only in a predetermined order, consecutively, because of mechanical design limitations. Therefore the time to access a given data location varies significantly depending on its physical location.

More information...

DDR4-2133
Max. RAM OC
i

Max. RAM OC

Describes how much memory can be overclocked (maxium RAM overclocking).

3200 MHz
Memory type
i

Memory type

DDR-SDRAM („Double Data Rate Synchronous Dynamic Random Access Memory“) ist ein Typ von Random Access Memory (RAM), den es aktuell in drei Kategorien gibt. DDR-SDRAM mit 184 Kontakten, DDR2-SDRAM mit 240 Kontakten und DDR3-SDRAM ebenfalls mit 240 Kontakten. Verwendet werden sie hauptsächlich für Speichermodule des DIMM- bzw. SO-DIMM-Standards als Arbeitsspeicher in PCs und Laptops.

More information...

DDR4-RAM
Channel Architektur
RAM buffer
i

RAM buffer

In addition to bandwidth and capacity variants, modules can
1. Optionally implement ECC, which is an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC in their designation.
2. Be "registered", which improves signal integrity (and hence potentially clock speed and physical slot capacity) by electrically buffering the signals at a cost of an extra clock of increased latency. Those modules are identified by an additional R in their designation, whereas non-registered (a.k.a. "unbuffered") RAM may be identified by an additional U in the designation.
3. Be Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion.

unbuffered
Memory form factor
i

Memory form factor

A DIMM or dual in-line memory module, comprises a series of dynamic random access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.

The main difference between SIMMs and DIMMs is that DIMMs have separate electrical contacts on each side of the module, while the contacts on SIMMs on both sides are redundant. Another difference is that standard SIMMs have a 32-bit data path, while standard DIMMs have a 64-bit data path.

More information...

DIMM 288

Mass storage controller 1

Data storage controller
Intel X99
S-ATA III
i

S-ATA III

Serial ATA (SATA) is a computer bus interface for connecting host bus adapters to mass storage devices such as hard disk drives and optical drives. Serial ATA 3 can transfer up to 6 Gbit/s.

More information...

10 x
RAID configuration
i

RAID configuration

RAID (redundant array of independent disks, originally redundant array of inexpensive disks) is a storage technology that combines multiple disk drive components into a logical unit. Data is distributed across the drives in one of several ways called "RAID levels", depending on what level of redundancy and performance (via parallel communication) is required.

More information...

JBOD
i

JBOD

JBOD bedeutet Just a Bunch of Disks, also: Nur ein Haufen Festplatten. Bei JBOD fehlt die Redundanz, daher gehört es nicht zu den RAID-Systemen, es ist nur ein einfaches „Array of Independent Disks“.

More information...

,
0
i

0

(block-level striping without parity or mirroring) has no (or zero) redundancy. It provides improved performance and additional storage but no fault tolerance.

More information...

,
1
i

1

(mirroring without parity or striping), data are written identically to two drives, thereby producing a "mirrored set"; the read request is serviced by either of the two drives containing the requested data, whichever one involves least seek time plus rotational latency.

More information...

,
5
i

5

(block-level striping with distributed parity) distributes parity along with the data and requires all drives but one to be present to operate; the array is not destroyed by a single drive failure.

More information...

,
10
i

10

Ein RAID-10-Verbund ist ein RAID 0 über mehrere RAID 1. Es werden dabei die Eigenschaften der beiden RAIDs kombiniert: Sicherheit und gesteigerte Schreib-/Lesegeschwindigkeit.
Ein RAID-10-Verbund benötigt mindestens vier Festplatten.

More information...

Expansion slots

i

Expansion slots

The expansion card (also expansion board, adapter card or accessory card) in computing is a printed circuit board that can be inserted into an electrical connector, or expansion slot on a computer motherboard, backplane or riser card to add functionality to a computer system via the expansion bus.

More information...

PCI Express x16
i

PCI Express x16

PCI Express („Peripheral Component Interconnect Express“, abgekürzt: PCIe oder PCI-E) ist ein Erweiterungsstandard zur Verbindung von Peripheriegeräten mit dem Chipsatz eines Hauptprozessors. PCIe ist der Nachfolger von PCI, PCI-X und AGP und bietet im Vergleich zu seinen Vorgängern eine höhere Datenübertragungsrate pro Pin.
Während ihrer Entwicklung wurde die Schnittstelle „3GIO“ genannt, was für „3rd Generation Input/Output“ steht.

More information...

3 x
PCI Express x8
i

PCI Express x8

PCI Express, officially abbreviated as PCI-E or PCIe, is a computer expansion card interface format introduced by Intel in 2004. PCI Express was designed to replace the general-purpose PCI expansion bus, the high-end PCI-X bus and the AGP graphics card interface. Unlike previous PC expansion interfaces, rather than being a bus it is structured around point-to-point serial links called lanes.

More information...

7 x

Graphics properties

i

Graphics properties

Beschreibt die Grafik Eigenschaften des Gerätes.

Multi-GPU technology
i

Multi-GPU technology

In der 3D-Computergrafik werden verschiedene Verfahren zur Lastverteilung der Rechenarbeit auf mehrere Grafikchips oder Grafikkarten eingesetzt. Der Sammelbegriff für diese unterschiedlichen Techniken lautet Multi-GPU. Obwohl jeder Hersteller ähnliche Betriebsmodi anbietet, ist der Name der jeweiligen Technik eine spezielle Marketing-Wortschöpfung.

More information...

NVIDIA SLI
i

NVIDIA SLI

Scalable Link Interface, kurz SLI, ist eine Multi-GPU-Technik von Nvidia, die die Zusammenschaltung von zwei oder mehr Grafikchips zur Leistungssteigerung beim Rendern (SLI Frame Rendering) oder den Einsatz von bis zu vier Bildschirmen (SLI Multi View) ermöglicht.

More information...

Network

RJ45/LAN port
i

RJ45/LAN port

Netzwerkanschluss erlaubt die Verbindung mit einem internen oder externen Netzwerk.

More information...

2 x
Max. port speed
i

Max. port speed

Describes the maximum data transfer rate. Is not necessarily supported by all ports.

More information...

1000 Mbit/s
i

1000 Mbit/s

In computer networking, Gigabit Ethernet (GbE or 1 GigE) is a term describing various technologies for transmitting Ethernet frames at a rate of a gigabit per second (1,000,000,000 bits per second).

More information...

Ethernet controller brand
i

Ethernet controller brand

Beschreibt die Marke des eingebauten Ethernet Controllers.

More information...

Intel
i

Intel

Intel Corporation is an American multinational semiconductor chip maker corporation headquartered in Santa Clara, California.

More information...

Audio

Audio channel
i

Audio channel

The descriptions of audio sound specifications distinguish between the number of discrete channels encoded in the original signal and the number of channels reproduced for playback.

7.1 Channel
Optical TOSLINK
i

Optical TOSLINK

S/PDIF (Sony/Philips Digital Interconnect Format) is a type of digital audio interconnect cable used in consumer audio equipment to output audio over reasonably short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.

More information...

1 x

Internal interfaces

USB 3.0 type A
i

USB 3.0 type A

The universal serial bus (USB) is a serial bus system for the connection of a computer to external devices. USB3.0 can reach up to 5 Gbit/s in Superspeed modus.

More information...

6 x
USB 2.0 Type-A
i

USB 2.0 Type-A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

More information...

8 x
Number of fan connector
i

Number of fan connector

Beschreibt wie viele Lüfterstecker auf dem Motherboard vorhanden sind.

More information...

6
Onboard power button
i

Onboard power button

Power-On Knopf auf dem Motherboard.

Yes
Reset button onboard
i

Reset button onboard

Reset Taste direkt auf dem Mainboard.

Yes

External interfaces

i

External interfaces

Beschreibt welche Schnittstellen das Gerät besitzt, die von aussen (das Gerät muss dafür nicht geöffnet werden) zugänglich sind.

USB 2.0 Type-A
i

USB 2.0 Type-A

Universal Serial Bus (USB) is a serial bus standard to interface devices. USB was designed to allow many peripherals to be connected using a single standardized interface socket and to improve the plug-and-play capabilities by allowing devices to be connected and disconnected without rebooting the computer (hot swapping). Other convenient features include providing power to low-consumption devices without the need for an external power supply and allowing many devices to be used without requiring manufacturer specific, individual device drivers to be installed.
The Mini-B, Micro-A, Micro-B , and Micro-AB connectors are used for smaller devices such as PDAs, mobile phones or digital cameras. The Standard-A plug is approximately 4 by 12 mm, the Standard-B approximately 7 by 8 mm, and the Micro-A and Micro-B plugs approximately 2 by 7 mm.

More information...

8 x
USB 3.0 type A
i

USB 3.0 type A

The universal serial bus (USB) is a serial bus system for the connection of a computer to external devices. USB3.0 can reach up to 5 Gbit/s in Superspeed modus.

More information...

6 x

Delivery contents

i

Delivery contents

The scope of delivery means the included accessories.

S-ATA cable
6 x
Manual
i

Manual

A user guide or user's guide, also commonly known as a manual, is a technical communication document intended to give assistance to people using a particular system.[1] It is usually written by a technical writer, although user guides are written by programmers, product or project managers, or other technical staff, particularly in smaller companies.

User guides are most commonly associated with electronic goods, computer hardware and software.

More information...

Yes

Product dimensions

i

Product dimensions

Physical size of an object

Length
304.80 mm
Width
263.50 mm

Please click directly on the incorrect data to access the registration form.

Alternatively, you can register a generic error-report (wrong picture, unsuitable accessories, etc.)

Cancel

Report incorrect data

Correction suggestion

Comment

Report incorrect data

Downloads

Technical data sheet | 1.3 MB | English

Warranty & right to return

Warranty 24 month Bring-in

Limited right of return

Warranty and return

Please use our simplified returns and warranty process to return a product or register a warranty case. Returns and warranty

Please use our simplified warranty process to view the warranty period as well as any warranty extensions you may have purchased. This will ensure that your return or warranty case is processed quickly and effectively.

Warranty extension

Warranty extension Bring-in

Warranty extension Bring-in

The warranty is extended at the same conditions as the manufacturer warranty.

to 3 years CHF 50.30
to 5 years CHF 67.80

More information about warranty extensions

Availability

Mail delivery

Mail delivery

 approx. 4-6 days
1 piece(s) ordered from the supplier.

Collection

Basel

 approx. 3-5 days
1 piece(s) ordered from the supplier.

Bern

 approx. 3-5 days
1 piece(s) ordered from the supplier.

Dietikon

 approx. 3-5 days
1 piece(s) ordered from the supplier.

Kriens

 approx. 3-5 days
1 piece(s) ordered from the supplier.

Lausanne

 approx. 3-5 days
1 piece(s) ordered from the supplier.

St Gallen

 approx. 3-5 days
1 piece(s) ordered from the supplier.

Winterthur

 approx. 3-5 days
1 piece(s) ordered from the supplier.

Wohlen

 approx. 1-3 days
1 piece(s) ordered from the supplier.

Zurich

 approx. 3-5 days
1 piece(s) ordered from the supplier.

If ordered immediately.
Information subject to change.

Customer questions and answers

No questions so far.

Do you have a question? Ask the digitec community.

Ask a question

Ask other customers about product properties, performance or use.

Customer ratings

This product has not yet been rated.

Have you tested this product? Share your opinion with the digitec community.

(0)
Rate product
EVGA X99 FTW (LGA 2011-v3, Intel X99, E-ATX) EVGA X99 FTW (LGA 2011-v3, Intel X99, E-ATX)